介质阻挡放电(DBD)用于绝缘材料表面改性是当前等离子体和材料改性领域的热点研究问题之一.通过介绍DBD的产生方法及放电特性,并分析了DBD等离子的物理化学过程,在此基础上综述了DBD等离子体用于绝缘材料表面改性的机理,改性的方法、改性的影响因素等,并分析了DBD等离子体用于绝缘材料表面改性的国内外研究现状、应用前景及研究中存在的主要问题等.
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