概述了高频电路对印制电路(PCB)基板的要求及现用基板的局限性.研究了基板树脂、增强纤维、整体结构等因数对基板材料改性的影响及其优缺点;分析从PCB上布线或其它方式优化基板性能的方法.总结了高频下测量介电常数的方法及计算介电常数的理论模型.指出了在高频PCB基板研究中还需要解决的问题及发展前景.
参考文献
| [1] | 王严杰,张续柱,肖忠良,王四清,陶文斌,杜立敏.高频低介电常数改性环氧树脂覆铜板的研制[J].工程塑料应用,2002(04):35-37. |
| [2] | 曹安照,田丽.介电常数、介质角正切对PCB特性阻抗的影响[J].自动化与仪器仪表,2003(06):47-48. |
| [3] | 王志勤.特性阻抗的工艺研究[J].电子工艺技术,2006(05):285-287. |
| [4] | DOUG LEYS .Best Materials for 3-6 GHz DESIGN[J].Printed circuit design & manufacture,2004(11):34,36-37,39-0. |
| [5] | 孟季茹,梁国正,赵磊,秦华宇.高性能PCB基体树脂的研究进展[J].材料导报,2001(06):55-57. |
| [6] | Jiru Meng;Guozheng Liang;Lei Zhao .Study on epoxy matrix modified with poly(2,6-dimethyl-1,4-phenylene ether) for application to copper clad laminate[J].Composites science and technology,2002(6):783-789. |
| [7] | 陈平,程子霞,朱岩松,金镇稿,雷清泉.低εr、低tgδ FR－4印刷电路基板的研制[J].纤维复合材料,2001(01):20-22,56. |
| [8] | 毛桂洁;陈平;程子霞.高性能新一代FR-4环氧基玻璃布层压板的改性研究[J].纤维复合材料,1998(12):31-36. |
| [9] | 祝大同.覆铜板用新型材料的发展（一）[J].印制电路信息,2001(12):7-11. |
| [10] | 赵磊,梁国正,孟季茹.双马来酰亚胺/溴化环氧树脂基覆铜箔板的研制[J].绝缘材料,2002(01):5-8. |
| [11] | 胡福田,杨卓如.玻璃纤维布增强聚四氟乙烯复合材料的制备及性能研究[J].化工新型材料,2006(12):19-22. |
| [12] | 苏民社,师剑英.聚苯醚/玻璃纤维布基覆铜板[J].绝缘材料,2003(02):34-36,47. |
| [13] | 周文胜,梁国正,房红强,任鹏刚,杨洁颖.高性能树脂基覆铜板的研究进展[J].工程塑料应用,2004(07):71-74. |
| [14] | 王结良,梁国正,杨洁颖,任鹏刚,赵雯,房红强.高频氰酸酯基覆铜板基板的研制[J].中国塑料,2004(01):46-49. |
| [15] | 师剑英.高频电路用覆铜箔聚酰亚胺玻璃布层压板[J].印制电路信息,2001(06):22-24,5. |
| [16] | 洪旭辉,华幼卿.玻璃纤维增强树脂基复合材料的介电特性[J].化工新型材料,2005(04):16-19. |
| [17] | 毕松梅,汪学骞,王扬,戴文琛,金世伟.7628玻纤混纺织物低介电性能的研究[J].纺织学报,2003(01):16-19. |
| [18] | S.M. Bleay;L. Humberstone .Mechanical and electrical assessment of hybrid composites containing hollow glass reinforcement[J].Composites science and technology,1999(9):1321-1329. |
| [19] | RICK HARTLEY .Designing PCBs with MIXED MATERIALS[J].Printed Circuit Design & Manufacture,2006(4):26-29. |
| [20] | Ionescu D;Cehan V.Composed Material Studies with Microwave Simulation Methods[A].Stara Lesna,2003:8-11. |
| [21] | 李刚,曹跃胜.嵌入电阻PCB设计与分析[J].计算机工程与设计,2006(06):1077-1080. |
| [22] | Andresakis J;Pramanik P;Brandler D.Novel Substrate with Combined Embedded Capacitance and Resistance for Better Electrical Performance and Higher Integration[A].San Diego,California,USA,2006:1544-1547. |
| [23] | Jong-Hyun Park;Cheng-Ji Xian;Nak-Jin Seong.Realization of a High Capacitance Density in BizMg2/3Nb4/307 Pyrochlore Thin Films Deposited Directly on Polymer Substrates for Embedded Capacitor Applications[J].Applied Physics Letters,2006(89):232910.1-232910.3. |
| [24] | Fukunaga K;Nishikata A;Kurahashi S.Dielectric Characteristics of Insulation Layers of Printed Circuit Boards at High Frequencies[A].Bali,2006:26-30. |
| [25] | Woo Seok Chin;Dai Gil Lee .Binary mixture rule for predicting the dielectric properties of unidirectional E-glass/epoxy composite[J].Composite Structures,2006(2):153-162. |
| [26] | Akihiro Namba;Osami Wada;Yoshitaka Toyota;Yukihiro Fukumoto;Zhi Liang Wang;Ryuji Koga;Takuya Miyashita;Tetsushi Watanabe .A simple method for measuring the relative permittivity of printed circuit board materials[J].IEEE Transactions on Electromagnetic Compatibility,2001(4):515-519. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%