概述了高频电路对印制电路(PCB)基板的要求及现用基板的局限性.研究了基板树脂、增强纤维、整体结构等因数对基板材料改性的影响及其优缺点;分析从PCB上布线或其它方式优化基板性能的方法.总结了高频下测量介电常数的方法及计算介电常数的理论模型.指出了在高频PCB基板研究中还需要解决的问题及发展前景.
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