环氧灌封料中无机填料的研究

绝缘材料, 2008, 41(5): 27-29. doi: 10.3969/j.issn.1009-9239.2008.05.007

环氧灌封料中无机填料的研究

狄宁宇 ^1, , 沈鉴烽 ^2, , 曹万荣 ^3, , 刘攀登 ^4, , 郑芳 ^5,

1.浙江荣泰科技企业有限公司,浙江,嘉兴,314007

2.浙江荣泰科技企业有限公司,浙江,嘉兴,314007

3.浙江荣泰科技企业有限公司,浙江,嘉兴,314007

4.浙江荣泰科技企业有限公司,浙江,嘉兴,314007

5.浙江荣泰科技企业有限公司,浙江,嘉兴,314007

关键词：环氧树脂 , 封装材料 , 无机填料 , 纳米复合材料

Advance of Application of Inorganic Filler in Epoxy Potting Compound

简述了环氧灌封料中无机填料的使用种类和性能,分析了纳米TiO2、SiO2等粒子对材料性能的影响.同时利用双层模型和公式模型解释了颗粒含量、颗粒大小等影响材料性能的原因.

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