综述了各向异性导电胶膜的结构、导电机理、性能指标及其研究进展,提出了各向异性导电胶膜存在的技术问题及发展方向,为进一步研究开发性价比更高的微电子互连用各向异性导电胶膜提供技术参考.
参考文献
[1] | 肖久梅,黄继华.微电子互连用导电胶研究进展[J].中国胶粘剂,2004(06):43-48. |
[2] | Jagt J C;Beris P J M;Lijten G et al.Electrically Conductive Adhesive:A Prospective Alternative for SMD Soldering[J].IEEE Trans Compon Packg Manuf Technol Part B,1995,18(02):292-298. |
[3] | Liu J;Lai Z.Overview of Conductive Adhesive Joining Technology in Electronics Packaging Applicatlons[A].,1998:1-17. |
[4] | 张军,陈旭.各向异性导电胶粘接可靠性研究进展[J].电子元件与材料,2004(01):35-38. |
[5] | Li L.;Morris J.E. .Electrical conduction models for isotropically conductive adhesive joints[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1997(1):3-8. |
[6] | Mizuno M.;Saka M. .Mechanism of electrical conduction through anisotropically conductive adhesive films[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1996(4):546-553. |
[7] | Shi F G;AbduuahM;Chungpaiboonpatana S et al.Electrical Coduction of Anisotropic Conductive Adhesives:Effect of Size Distribution of Conducting Filler Particles[J].Materials Science in Semiconductor Processing,1999,2:263-269. |
[8] | 向昊,曾黎明,胡传群.各向异性导电胶的研究与应用现状[J].粘接,2008(10):42-44. |
[9] | 曾黎明.功能复合材料及其应用[M].北京:化学工业出版社,2006 |
[10] | M. Sun 20f .Conductivity of conductive polymer for flip chip bonding and BGA socket[J].Microelectronics journal,2001(3):197-203. |
[11] | J. Liu .Recent advances in conductive adhesives for direct chip attach applications[J].Microsystem technologies,1998(2):72-80. |
[12] | Paik Kyuny-Wook;Yim Myung-Jin.New Anisotropic Conductive Adhesive for Low Cost and Reliable Flip Chip on Organic Substrates Applications[A].,2000:282-288. |
[13] | 张洪波,苏春辉,许素莲.新型导电膜的制备及性能研究[J].化学与粘合,2004(06):321-323. |
[14] | 沈志刚,俞晓正,徐政,裴喜华.微颗粒表面磁控溅射镀金属膜实验[J].北京航空航天大学学报,2006(10):1193-1198,1204. |
[15] | Kyoung Sik Moom;Silvia Liong;Li Haiying et al.Stabiling Contact Resistance of Isotrop Ically Conductive Adhesives on Variousmetal Surfaces by Incorporating Sacrificial Anode Materiais[J].Journal of Elctronic Materials,2004,33(11):1381-1388. |
[16] | Majima Masatoshi;Koyama Keiji;Tani Yoshie.Development of Conductive Material Using Nano-particles[J].SEI Technical Review,2002(54):1343-1349. |
[17] | Genetti WB.;Grady BP.;O'Rear EA.;Lai CL.;Glatzhofer DT.;Yuan WL. .Polymer matrix composites: Conductivity enhancement through polypyrrole coating of nickel flake[J].Journal of Materials Science,1998(12):3085-3093. |
[18] | Hvims H.L. .Conductive adhesives for SMT and potential applications[J].IEEE transactions on components, packaging, and manufacturing technology.Part B.Advanced packaging,1995(2):284-291. |
[19] | Keusseyan R L;Dilday J L;Speck B S .Electric Contact Phenomena in Conductive Adhesive Interconnections[J].International Journal of Microcircuits and Electronic Packaging,1994,17(03):236-241. |
[20] | Wong C P;Lu Daoqiang.Recent Advances on Electrically Conductives for Electronics Applications[A].,2000:121-128. |
[21] | Nguyen G;Wiiliams J;Gibson F.Electricai Reliability of Conductive Adhesives for Surface Mount Applications[A].,1993:479-486. |
[22] | Botter H.Factors That Influence the Electrical Contact Resistance of Isotropic Conductive Adhesive Joints During Climate Chamer Testing[A].,1996:30-37. |
[23] | Liu J.;Gustafsson K. .Surface characteristics, reliability, and failure mechanisms of tin/lead, copper, and gold metallizations[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1997(1):21-30. |
[24] | Jagt J.C. .Reliability of electrically conductive adhesive joints for surface mount applications: a summary of the state of the art[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1998(2):215-225. |
[25] | Dao Qiang Lu;C P Wong.Effects of Shrinkage on Conductivity of Isotropic Conductive Adhesives[J].International Journal of Adhesion and Adhesives,2000(20):189-193. |
[26] | M.A.uddin;M.O.Alam;Y.C.Chan;H.P.Chan .Plasma cleaning of the flex substrate for flip-chip bonding with anisotropic conductive adhesive film[J].Journal of Electronic Materials,2003(10):1117-1124. |
[27] | 黎文部,王洛礼,于洁.各向异性导电胶粘剂膜的研究进展[J].电子元件与材料,2006(02):4-7. |
[28] | 倪晓军,梁彤翔.导电胶的研究进展[J].电子元件与材料,2002(01):1-3,7. |
[29] | Liong S;Wong C P.An Alternative to Epoxy Resin for Application in Isotropically Adhesive[A].Brasehon GA,2001:13-18. |
[30] | 倪晓军,梁彤祥,刘杨秋,符晓铭.精细电路连接用紫外光固化各向异性导电胶[J].电子元件与材料,2002(08):9-10,13. |
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