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采用两步法将超支化聚芳酰胺接枝到氮化硼粒子表面,并将其掺入到环氧树脂中,制备了一系列复合材料,并对复合材料的微观形貌、玻璃化转变温度、导热性能及电气强度进行了测试研究.结果表明:超支化聚芳酰胺接枝氮化硼粒子在环氧树脂中有较好的分散性,复合材料的电气强度、玻璃化转变温度和导热系数均得到了提高.

参考文献

[1] Toshikatsu Tanaka .Dielectric Nanocomposites with Insulating Properties[J].IEEE transactions on dielectrics and electrical insulation: A publication of the IEEE Dielectrics and Electrical Insulation Society,2005(5):914-928.
[2] 赫兟,周键.高导热绝缘材料对降低电机温升的重要作用[J].绝缘材料,2008(04):22-23.
[3] 张秀菊,李波,林志丹,王勇,吕丽霞,许吉庆,郑少杰.电子封装用复合导热绝缘环氧胶粘剂的研制[J].绝缘材料,2009(01):1-4,14.
[4] 胡慧慧,李凡,李立群.环氧树脂基导热绝缘复合材料的研究进展[J].绝缘材料,2011(05):27-30.
[5] Kim W;Bae J W;Choi I D et al.Thermally Conductive EMC (Epoxy Molding Compound) for Microelectronic Encapsulation[J].Polymer Engineering and Science,1999,39(04):756-766.
[6] Chung D.D.L. .Polymer-Matrix Composites for Microelectronics[J].Polymers & Polymer Composites,2000(4):219-229.
[7] 王聪.环氧树脂/氧化铝导热复合材料的结构设计和制备[J].绝缘材料,2010(01):52-55.
[8] D. D. L. Chung .Materials for thermal conduction[J].Applied thermal engineering: Design, processes, equipment, economics,2001(16):1593-1605.
[9] Geon-Woong Lee;Min Park;Junkyung Kim .Enhanced thermal conductivity of polymer composites filled with hybrid filler[J].Composites, Part A. Applied science and manufacturing,2006(5):727-734.
[10] Wong C.P.;Bollampally S. .Thermal Conductivity,Elastic Modulus,and Coefficient of Thermal Expansion of Polymer Composites Filled with Ceramic Particles for Electronic Packaging[J].Journal of Applied Polymer Science,1999(14):3396-3403.
[11] Yunsheng Xu;D. D. L. Chung;Cathleen Mroz .Thermally conducting aluminum nitride polymer-matrix composites[J].Composites, Part A. Applied science and manufacturing,2001(12):1749-1757.
[12] Ishida H.;Rimdusit S. .Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine[J].Thermochimica Acta: An International Journal Concerned with the Broader Aspects of Thermochemistry and Its Applications to Chemical Problems,1998(1/2):177-186.
[13] Li L;Chung D D L .Thermally Conducting Polymer-matrix Composites Containing both AIN Particles and SiC Whiskers[J].Journal of Electronic Materials,1994,23(06):557-564.
[14] W. Sun Lee;J. Yu .Comparative study of thermally conductive fillers in underfill for the electronic components[J].Diamond and Related Materials,2005(10):1647-1653.
[15] 赫兟,徐旭,饶保林.环氧树脂固化物结构与热传导性能的关系[J].绝缘材料,2009(02):46-47,51.
[16] Chen G .Size and Interface Effects on Thermal Conductivity of Superlattices and Periodic Thin-film Structures[J].Journal of Heat Transfer,1997,119(02):220-228.
[17] Lin W;Moon K S;Wong C P .A Combined Process of in Situ Functionalization and Microwave Treatment to Achieve Ultrasmall Thermal Expansion of Aligned Carbon Nanotube-Polymer Nanocomposites:Toward Applications as Thermal Interface Materials[J].Advanced Materials,2009,21(23):2421-2424.
[18] Lyeo HK;Cahill DG .Thermal conductance of interfaces between highly dissimilar materials[J].Physical review, B. Condensed matter and materials physics,2006(14):4301-1-4301-6-0.
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