系统研究了航空涡轮盘GH4586A和GH4586B合金在700～800℃长期时效时,合金微观组织的演变过程.重点研究了时效过程中沉淀强化相与奥氏体基体的稳定性,尤其是拓扑密排相(TCP相)析出行为及其与时效温度和时效时间的关系.研究表明,长期时效过程中GH4586B合金未见TCP相析出,但γ相随时效时间的延长快速粗化,导致合金室温与高温强度显著衰减.GH4586A合金的γ相长大缓慢,从而保持了稳定的抗拉强度,但在750℃、2000h以上时效时出现了μ相析出在晶界与晶内M6C二次碳化物表面形核并以半共格形式向奥氏体基体内生长,致使合金的塑性有所下降.
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