采用反应磁控溅射法制备SnO2薄膜经常出现化学计量比的失衡问题.通过控制溅射过程中的氧分压制备不同化学计量比的SnO2-x薄膜,研究非化学计量比对薄膜结构、成分以及气敏性能的影响.XRD结果表明氧分压对材料结构和取向的影响非常显著.薄膜的O/Sn和表面化学成分通过XPS进行确定,分析发现氧分压的增加促使薄膜接近化学计量比,但表面化学吸附氧含量在0.33Pa氧分压下达到最大.气敏性能测试表明,非化学计量比主要影响薄膜表面的化学吸附氧数量,从而影响导电性和气体敏感性.氧分压对薄膜化学吸附氧的影响趋势与对气敏性能的影响趋势一致.0.33Pa氧分压下制备的薄膜拥有最多的表面吸附氧,同时对氢气的灵敏度高达45.6%.另外,在0.2~0.5Pa氧分压下制备的薄膜对氢气具有较好的选择性.
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