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对工业纯铜在150℃条件下进行多向挤压,研究多向挤压工艺对纯铜组织和性能的影响.随着挤压道次的增加,材料晶粒得到明显细化,最终得到晶粒尺寸为微米级的等轴细晶组织.材料的显微硬度和抗拉强度在低道次挤压时迅速上升之后趋于饱和,延伸率在前期明显下降后也趋于稳定,其断裂性质仍是韧性断裂.经过15个道次挤压,晶粒平均尺寸达到0.78μm,抗拉强度达到485.5 MPa,显微硬度达129.4 HV0.2,断后延伸率为18.7%.

参考文献

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