以TC4钛合金为基体进行熔盐电解渗硼,利用辉光放电光谱仪(GDOES)、扫描电镜(SEM)、X射线衍射仪(XRD)和显微硬度计研究电流密度对渗硼层厚度、成分、组织、相结构及硬度的影响.结果表明:电流密度在50～90 mA/cm2时,渗硼层晶粒随电流密度的增加由粗大变得细小,渗硼层厚度先增大后减小,电流密度为60 mA/cm2时渗硼层厚度最大.渗硼层不含Al,而V则易固溶于硼化物中.渗硼层主要由TiB和TiB2组成,在(111)晶面择优生长.渗硼层的显微硬度相对基体硬度提高了5倍.
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