欢迎登录材料期刊网

材料期刊网

高级检索

印刷电子是一种基于印刷原理的新兴电子增材制造技术,与传统电子加工方法相比,它在大面积、柔性化、个性化、低成本制造电子等方面具有无可比拟的优势.印刷电子所用的典型导电墨水通常分为三类:碳系、高分子及金属导电墨水,然而它们在打印后仍需借助高温后处理工艺,以进一步提升打印物及墨水的电导率及运行可靠性,步骤稍显繁琐;且由于相应纳米材料及墨水的配制较为复杂,也增加了使用的成本.液态金属作为一大类新出现的电子打印墨水,近年来正日益成为重要的研究领域,这种墨水具有电导率高、制备简单、无需后处理等独特优点.为推动这一方向的研究,本文评述了国内外围绕液态金属导电墨水物理化学性质的研究进展及对应的典型打印方法,并指出了进一步发展的方向.

参考文献

[1] 崔铮.印刷电子学[M].北京:高等教育出版社,2010.,2010.
[2] Cui Z.Printed Electronics[M].Beijing:Higher Education Press,2010.,2010.
[3] 庄严.印刷电子学的发展[J].电子元件与材料,2010(09):1-5.
[4] 辛智青,李路海,方一,唐小君,赵文,杜鹏.环保型纳米尺度导电油墨研究[C].第二届全国精细化工清洁生产工艺与技术经济发展研讨会论文集,2009:19-20.
[5] 曹继汉.印刷电子技术的应用与发展[C].2009中国高端SMT学术会议论文集,2009:93-103.
[6] 单静 .无颗粒型铜导电墨水的制备及成膜研究[D].天津大学,2013.
[7] Shan J.Preparation and filn formation investigation of copper based particle free conductive ink[D].Tianjin University,2013.,2013.
[8] Hyun W J,Park O O,Chin B D .Foldable grapheme electronic circuits based on paper substrates[J].Advanced Materials,2013,25(34):4729-4734.,2013.
[9] Aydemir N,Parcell J,Laslau C,Nieuwoudt M,Williams D E,Travas-Sejdic J .Direct writing of conducting polymners[J].Macromolecular Rapid Communications,2013,34(16):1296-1300.,2013.
[10] Piner R D,Zhu J,Xu F,Hong S H,Mirkin C A ."Dip-pen"nanolithography[J].Science,1999,283(5402):661-663.,1999.
[11] Salaita K,Wang Y H,Mirkin C A .Applications of dip-pen nanolithography[J].NatureNanotechnology,2007,2(3):145-155.,2007.
[12] Yun M H,Myung N V,Vasquez R P,Lee C S,Menke E,Penner R M .Electrochemically grown wires for individually addressable sensor arrays[J].Nano Letters,2004,4(3):419-422.,2004.
[13] Yoshioka Y,Jabbour G E .Desktop inkjet printer as a tool to print conducting polymers[J].Synthetic Metals,2006,156:779-783.,2006.
[14] Yun Y H,Lee B K,Choi J S,Kim S,Yoo B,Kim Y S,Park K,Cho Y W .A glucose sensor fabricated by piezoelectric inkjet printing of conducting polymers and bienzymes[J].Analytical Sciences,2011,27(4):375-379.,2011.
[15] Russo A,Ahn B Y,Adams J J,Duoss E B,Bernhard J T,Lewis J A .Pen on paper flexible electronics[J].Advanced Materials,2011,23(30):3426.,2011.
[16] Zhang Q,Zheng Y,Liu J .Direct writing of electronics based on alloy and metal ink (DREAM ink):a newly emerging area and its impact on energy,environment and health sciences[J].Frontiers in Energy,2012,6(4):a newly emerging area and its impact on energy,environment and health sciences[J].Frontiers in Energy,2012,6(4):311-340.,2012.
[17] Trasande L,Landrigan P J,Schechter C .Public health and economic consequences of methyl mercury toxicity to the developing brain[J].Environmental Health Perspectives,2005,113(5):590-596.,2005.
[18] Wood J M .Biological cycles for toxic elements in the environment[J].Science,1974,183(4129):1049-1052.,1974.
[19] Zahir F,Rizwi S J,Haq S K,Khan R H .Low dose mercury toxicity and human health[J].Environmental Toxicology and Pharmacology,2005,20(2):351-360.,2005.
[20] Sostman H E .Melting point of gallium as a temperature calibration standard[J].Review of Scientific Instruments,1977,48(2):127-130.,1977.
[21] SIGMA-ALDRICH,2011,in Adobe Reader,edited by MSDS.,2011.
[22] Surmann P,Zeyat H .Voltammetric analysis using a selfrenewable non mercury electrode[J].Analytical and Bioanalytical Chemistry,2005,383(6):1009-1013.,2005.
[23] Assael M J,Armyra I J,Brillo J,Stankus S V,Wu J T,Wakeham W A .Reference data for the density and viscosity of liquid cadmium,cobalt,gallium,indium,mercury,silicon,thallium,and zinc[J].Journal of Physical and Chemical Reference Data,2012,41(3):033101.,2012.
[24] Dickey M D,Chiechi R C,Larsen R J,Weiss E A,Weitz D A,Whitesides G M .Eutectic gallium indium (EGaIn):a liquid metal alloy for the formation of stable structures in microchannels at room temperature[J].Advanced Functional Materials,2008,18(7):a liquid metal alloy for the formation of stable structures in microchannels at room temperature[J].Advanced Functional Materials,2008,18(7):1097-1104.,2008.
[25] Alchagirov B B,Mozgovoi A G .The surface tension of molten gallium at high temperatures[J].High Temperature,2005,43(5):791-792.,2005.
[26] Larsen R J,Dickey M D,Whitesides G M,Weitz D A .Viscoelastic properties of oxide coated liquid metals[J].Journal of Rheology,2009,53(6):1305-1326.,2009.
[27] Liu T Y,Sen P,Kim C J .Characterization of nontoxic liquid-metal alloy galinstan for applications in microdevices[J].Journal of Microelectromechanical Systems,2012,21(2):443-450.,2012.
[28] Ma K Q,Liu J .Liquid metal cooling in thermal management of computer chip[J].Frontiers of Energy and Power Engineering in China,2007,1(4):384-402.,2007.
[29] 邰艳龙 .印制电子用导电墨水的制备及应用[D].复旦大学,2012.
[30] Glatzel S,Schnepp Z,Giordano C .From paper to structured carbon electrodes by inkjet printing[J].Angewandte Chemie-International Edition,2013,52(8):2355-2358.,2013.
[31] Pidcock G C,Panhuis M I H .Extrusion printing of flexible electrically conducting carbon nanotube networks[J].Advanced Functional Materials,2012(22):4790-4800.,2012.
[32] Xiong Z T,Liu C Q .Optimization of inkjet printed PEDOT:PSS thin films through annealing processes[J].Organic Electronics,2012,13(9):1532-1540.,2012.
[33] Mo L X,Liu D Z,Li W,Li L H,Wang L C,Zhou X Q .Effects of dodecylamine and dodecanethiol on the conduc tive properties of nano Ag films[J].Applied Surface Science,2011,257(13):5746-5753.,2011.
[34] Lee H H,Chou K S,Huang K C .Inkjet printing of nanosized silver colloids[J].Nanotechnology,2005,16(10):2436-2441.,2005.
[35] Regan M J,Tostmann,H,Pershan P S,Magnussen O M,DiMasi E,Ocko B M,Deutsch M .X-ray study of the oxidation of lquid-gallium surfaces[J].Physical Review B,1997,55(16):10786-10790.,1997.
[36] Tostmann H,DiMasi E,Pershan P S,Ocko B M,Shpyrko O G,Deutsch M .Surface structure of liquid metals and the effect of capillary waves:X-ray studies on liquid indium[J].Physical Review B,1999,59(2):783-791.,1999.
[37] 李海燕,刘静.液态金属电子墨水与印刷基底之间的撞击作用机制研究[J].电子机械工程,2014,印刷中.Li H,Liu J.Investigation on the impacting mechanism of liquid metal electronic ink[J].Electro-Mechanical Engineering,2014,in press.,2014.
[38] Liu Y,Gao M,Mei S F,Han Y T,Liu J .Ultra-compliant liquid metal electrodes with in plane self-healing capability for dielectric elastomer actuators[J].Applied Physics Letters,2013,102
[39] 李海燕,周远,刘静 .基于液态金属的可印刷式热电发生器及其性能评估,中国科学E辑,2013,44:407-416.Li H,Zhou Y,Liu J.Liquid metal based printable thermoelectronic generator and its performance evaluation[J].Science China Technological Sciences,2013,44
[40] Gao Y X,Li H Y,Liu J .Direct writing of flexible electronics through room temperature liquid metal ink[J].PLoSONE,2012,7(9):e45485.,2012.
[41] Zheng Y,He Z Z,Yang J,Liu J .Personal electronics printing via tapping mode composite liquid metal ink delivery and adhesion mechanism[J].Scientific Reports,2014,4
[42] Kramer R K,Boley J W,Stone H A,Weaver J C,Wood R J .Effect of microtextured surface topography on the wetting behavior of eutectic gallium indium alloys[J].Langmuir,2014,30(2):533-539.,2014.
[43] Zheng Y,He Z Z,Gao Y X,Liu,J .Direct desktop printed circuits on paper flexible electronics[J].Scientific Reports,2013,3
[44] Zhang Q,Gao Y X,Liu J .Atomized spraying of liquid metal droplets on desired substrate surfaces as a generalized way for ubiquitous printed electronics[J].Applied PhysicsA,2013,113(4):1-7.,2013.
[45] Tabatabai A,Fassler A,Usiak C,Majidi C .Liquid-phase gallium-indium alloy electronics with microcontact printing[J].Langmuir,2013,29(20):6194-6200.,2013.
[46] Kramer R K,Majidi C,Wood R J .Masked deposition of gallium indium alloys for liquid embedded elastomer conductors[J].Advanced Functional Materials,2013,23(42):5292-5296.,2013.
[47] Lei WANG,Jing LIU.Liquid metal material genome: Initiation of a new research track towards discovery of advanced energy materials[J].能源前沿,2013(03):317-332.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%