为了提高TiB2涂层的致密性,采用磁控溅射技术,通过改变基片偏压,获得了floating,-30V,-90V三种偏压状态的涂层.利用XRD,SEM、纳米压痕仪、Vickers显微硬度仪和摩擦磨损试验机对涂层的结构和性能进行了分析.结果表明:所有制备涂层只存在六方结构TiB2相,偏压为floating状态时制备的涂层表现出疏松的柱状生长结构,硬度为15GPa.随偏压增大,涂层柱状结构变致密甚至消失,硬度和耐磨损性能都得到提高.偏压-30V提高到-90V,相对于floating状态制备的涂层,晶粒尺寸增加了一倍,达到21nm;柱状结构变致密最终消除;硬度从35.5GPa提高到61.9GPa,实现了超硬;同时耐磨损性能提高,使用摩擦副为直径6mm的Al2O3球进行干摩擦实验时,-90V制备的涂层磨损率为5.6×10-16m3/Nm,相对于-30V涂层降低了一个数量级.
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