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以阴极析出的氢气泡为模板电沉积制得三维多孔铜薄膜,电解液的组成和工艺条件为:CuSO4 50 g/L,H2SO4 147 g/L,Na2SO4 70.2 g/L,HCHO 30 g/L,HCl 0.25 mL/L,聚乙二醇0.25 mL/L,十六烷基三甲基溴化铵(CTAB)0 ~ 9.75 g/L,温度25℃,电流密度3A/cm2,时间10~ 20 s.研究了电沉积时间及CTAB用量对薄膜结构的影响.结果表明,随沉积时间的延长,镀层的主孔径增大,孔壁变厚.镀液中CTAB的存在会影响铜离子的沉积和结晶取向,随着镀液中CTAB质量浓度的增大,多孔铜薄膜的孔径先减小后增大.

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