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铱是航天领域1800℃以上炭/炭复合材料抗氧化抗热震涂层的首选材料.本文介绍了物理气相沉积、金属有机物化学气相沉积、熔盐电解沉积和双层辉光等离子沉积等4种主要制备铱涂层的方法,讨论了铱涂层与炭/炭复合材料基体之间过渡层的材料选择,总结了铱涂层的地面试车测试结果,分析了影响铱涂层寿命的因素,指出今后我国制备铱涂层的技术途径应采用熔盐电解沉积(Electfoformed Deposition,简写为ED)、双层辉光等离子沉积(Double-glow Plasma Deposition,简写为DPD)方法.

参考文献

[1] Windhors T et al.[J].Materials & Design,1997,18(01):11.
[2] 曾燮榕,李贺军,杨峥.碳/碳复合材料表面MoSi2-SiC复相陶瓷涂层及其抗氧化机制[J].硅酸盐学报,1999(01):8-15.
[3] Li H J et al.[J].Carbon,2006,44:602.
[4] Fu Q G et al.[J].Materials Science and Engineering A,2006,434(1-2):335.
[5] Strife J R et al.[J].Ceram Bulletin,1988,67(02):369.
[6] Schoenman L .[J].Journal of Propulsion and Power,1995,11(06):1261.
[7] Merker J.[A].Nashville:The Minerals,Metals & Materials Society,2000:109.
[8] Hosoda H;Yoshinao M;Hideo T.Nanomaterials:From Research to Applications[M].Amsterdam:Elsevier Science & Technology,2006
[9] Tuffias R H et al.[P].US Patent,5855828,1999.
[10] Goto T et al.[J].Journal De Physique,1993,Ⅳ:297.
[11] Echigoya J;Mumtaz K;Hayasaka Y;Aoyagi E .Electron microscopic study of sputter-deposited Ir films[J].Journal of Materials Science,2004(20):6215-6219.
[12] Bogorin, DF;Galeazzi, M .Characterization of iridium thin films for TES microcalorimeters[J].Journal of Low Temperature Physics,2008(1/2):167-172.
[13] Snell L et al.[J].Carbon,2001,39(07):991.
[14] Ogura Y;Kobayashi C;Ooba Y;Yahata N;Sakamoto H .Low temperature deposition of metal films by metal chloride reduction chemical vapor deposition[J].Surface & Coatings Technology,2006(10):3347-3350.
[15] Lee In-Seop et al.[J].Journal of Materials Science Letters,2002,21:1859.
[16] Khoa TD.;Horii S.;Horita S. .High deposition rate of epitaxial (100) iridium film on (100)YSZ/1 0 0)Si substrate by RF sputtering deposition[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2002(1/2):88-94.
[17] Dey S K et al.[J].Japanese Journal of Applied Physics Part 2:Letters,1999,38(9A/B):1052.
[18] Toenshoff D A.[A].Cleveland:AIAA,2000:3166.
[19] Brian D R.[A].Cleveland:American Institute of Aeronautics and Astronautics,1998
[20] Chen Z F et al.[J].International Journal of Fracture,2008,153:185.
[21] Kawase M.;Ito Y. .The electroformation of Zr metal, Zr-Al alloy and carbon films on ceramic[J].Journal of Applied Electrochemistry,2003(9):785-793.
[22] Saltykova N A et al.[J].Elektrokhimiya,2001,37(09):1076.
[23] Mumtaz K.;Enoki H.;Hirai T.;Shindo Y.;Echigoya J. .THERMAL CYCLING OF IRIDIUM COATINGS ON ISOTROPIC GRAPHITE[J].Journal of Materials Science,1995(2):465-472.
[24] Mumtaz K et al.[J].Materials Science and Engineering,1993,A 167:187.
[25] Endle J P et al.[J].Thin Solid Films,2001,388:126.
[26] 华云峰 .铱与高温陶瓷固相反应研究[D].西安:西北工业大学,2004.
[27] Goto T et al.[J].Materials Science and Engineering,1996,A217-218:223.
[28] Morozova N B et al.[J].Journal of Thermal Analysis and Calorimetry,2000,60:489.
[29] Sun Y M et al.[J].Thin Solid Films,1999,346:100.
[30] Goto T et al.[J].Scripta Materialia,2001,44:1187.
[31] Igumenov I K et al.[J].Desalination,2001,136:273.
[32] lsakova V G et al.[J].Polyhedron,2000,19:1097.
[33] Sun Y M et al.[J].Journal of Vacuum Science and Technology A:Vacuum Surfaces and Films,2000,18(01):10.
[34] Goswami J et al.[J].Journal of Materials Research,2001,16(08):2192.
[35] Maury F.;Senocq F. .Iridium coatings grown by metal-organic chemical vapor deposition in a hot-wall CVD reactor[J].Surface & Coatings Technology,2003(0):208-213.
[36] Chen Y L et al.[J].Chemical Vapor Deposition,2002,8(01):17.
[37] Yan X et al.[J].Materials Letters,2007,61:216.
[38] Gelfond N V et al.[J].Thin Solid Films,1993,227:144.
[39] Yan X M et al.[J].Thin Solid Films,2001,391:62.
[40] Lisker M;Hur'yeva T;Ritterhaus Y;Burte EP .Effect of annealing in oxygen atmosphere on morphological and electrical properties of iridium and ruthenium thin films prepared by liquid delivery MOCVD[J].Surface & Coatings Technology,2007(22/23):9294-9298.
[41] 华云峰,陈照峰,张立同,成来飞.MOCVD Ir薄膜的制备与沉积效果分析[J].稀有金属材料与工程,2005(01):139-142.
[42] Hua Y F et al.[J].Materials Science and Engineering B,2005,121:156.
[43] 杨文彬,张立同,成来飞,华云峰,张钧.金属有机物化学气相沉积法制备铱涂层的形貌与结构分析[J].稀有金属材料与工程,2006(03):488-491.
[44] Badalyan A M et al.[J].J Structural Chemistry,2002,43(04):556.
[45] Yang W B et al.[J].Inter J Refractory Metals & Hard Mater,2009,27:33.
[46] 段淑贞.熔盐电化学原理和应用[M].北京:冶金工业出版社,1990
[47] Strife J R et al.[J].Journal of the American Ceramic Society,1990,73(04):838.
[48] Holleck H .[J].Metall,1983,37(07):703.
[49] Chou T C .[J].Scripta Metallurgica et Materialia,1990,24:1131.
[50] Sherman A J et al.[J].JOM-Journal of the Minerals Metals and Materials Society,1991,7:20.
[51] Hua Y F et al.[J].Journal of Materials Science,2006,41:2155.
[52] 胡昌义,陈松,杨家明,邓德国,高逸群,尹志民,王云,李靖华.CVD法制备的Ir/Re涂层复合材料界面扩散研究[J].稀有金属材料与工程,2003(10):796-798.
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