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在(0001)面的蓝宝石衬底上用MOCVD法生长纤锌矿结构的GaN.GaN膜总厚度为4μm,表层为0.5μm厚的掺Mg的p型层.用90keV的Mn+离子对处于室温下的GaN进行离子注入,注入剂量为1×1015~5×1016ions/cm2.对注入的样品在N2气流中经约800℃进行快速热退火处理,时间为30~90s.样品的磁性用超导量子干涉仪(SQUID)进行分析.未注入的p型GaN薄膜是抗磁性的,而Mn+注入的GaN显现顺磁性(注入剂量为1×1015ions/cm2)和铁磁性(注入剂量为5×1015~5×1016ions/cm2).结合X射线衍射(XRD)和扫描电子显微镜(SEM)对GaN薄膜在注入和退火后的结构和形貌研究,揭示Mn+ 注入是进行GaN磁性掺杂的有效手段,在Mn+ 注入p型GaN、制备得到的(Ga,Mn)N稀磁半导体中,空穴调制铁磁性是其主要的磁性机制.

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