欢迎登录材料期刊网

材料期刊网

中国科学院金属研究所 科学出版社
高级检索
  1. 首页
  2. 期刊
  3. 影像科学与光化学
  4. 光子烧结技术在印刷电子技术中的应用研究进展

影像科学与光化学 , 2014, 32(4): 303-313. doi: 10.7517/j.issn.1674-0475.2014.04.303

光子烧结技术在印刷电子技术中的应用研究进展

顾唯兵 1, , 林剑 2, , 陈征 3, , 崔铮 4,

1.中国科学院苏州纳米技术与纳米仿生研究所印刷电子研究中心,江苏苏州,215123

2.中国科学院苏州纳米技术与纳米仿生研究所印刷电子研究中心,江苏苏州,215123

3.中国科学院苏州纳米技术与纳米仿生研究所印刷电子研究中心,江苏苏州,215123

4.中国科学院苏州纳米技术与纳米仿生研究所印刷电子研究中心,江苏苏州,215123

基金项目:   中国科学院战略性先导科技专项子课题(XDA09020201)   国家自然科学基金重大研究计划重点支持项目(91123034)  

关键词： 光子烧结 , 印刷电子 , 激光 , 红外 , 闪灯

Research Progress of Photonic Sintering Technology in Printable Electronics

Keywords： photonic sintering , printable electronics , laser , infrared , pulsed light

光子烧结技术是一种低温、选择性、非接触式烧结技术,可以对衬底上的各种纳米材料墨水进行固化烧结,实现墨水的功能化,并获得印刷电子器件的物理性能.光子烧结技术包括激光烧结、红外烧结及闪灯烧结,它们又具有各自的应用特点,在印刷电子领域中受到了广泛的关注.本文简要介绍了光子烧结技术的一些相关研究,重点介绍了光子烧结技术在金属纳米导电墨水中的应用及研究进展.

参考文献

[1] 崔铮,邱松,陈征,林剑,赵建文,马昌期,苏文明.印刷电子学 材料、技术及其应用[M].北京:高等教育出版社,2012.16-19.Cui Z,Qiu S,Chen Z,Lin J,Zhao J W,Ma C Q,Su W M.Printed Electronics:Materials,Technologies and Applications[M].Beijing:Higher Education Press,2012.16-19.,2012.
[2] Kim C,Nogi M,Suganuma K .Electrical conductivity enhancement in inkjet-printed narrow lines through gradual heating[J].Journal of Micromechanics and Microengineering,2012,22(3):5.,2012.
[3] Jeong S,Song H C,Lee W W,Choi Y,Ryu B H .Preparation of aqueous Ag Ink with long-term dispersion stability and its inkjet printing for fabricating conductive tracks on a polyimide film[J].Journal of Applied Physics,2010,108(10):5.,2010.
[4] Allen M,Alastalo A,Suhonen M,Mattila T,Leppaniemi J,Seppa H .Contactless electrical sintering of silver nanoparticles on flexible substrates[J].IEEE Transactions on Microwave Theory and Techniques,2011,59(5):1419-1429.,2011.
[5] Perelaer J,Jani R,Grouchko M,Kamyshny A,Magdassi S,Schubert U S .Plasma and microwave flash sintering of a tailored silver nanoparticle ink,yielding 60% bulk conductivity on cost-effective polymer foils[J].Advanced Materials,2012,24(29):3993-3998.,2012.
[6] Reinhold I,Hendriks C E,Eckardt R,Kranenburg J M,Perelaer J,Baumann R R,Schubert U S .Argon plasma sintering of inkjet printed silver tracks on polymer substrates[J].Journal of Materials Chemistry,2009,19(21):3384-3388.,2009.
[7] Buffat P,Borel J P .Size effect on melting temperature of gold particles[J].Physical Review A,1976,13(6):2287-2298.,1976.
[8] Shyjumon I,Gopinadhan M,Ivanova O,Quaasz M,Wulff H,Helm C A,Hippler R .Structural deformation,melting point and lattice parameter studies of size selected silver clusters[J].European Physical Journal D,2006,37(3):409-415.,2006.
[9] Bohren C F,Huffman D R.Absorption and Scattering of Light by Small Particles[M].New York:Wiley.1983.,1983.
[10] Lesyuk R,Jillek W,Bobitski Y,Kotlyarchuk B .Low-energy pulsed laser treatment of silver nanoparticles for interconnects fabrication by ink-jet method[J].Microelectronic Engineering,2011,88(3):318-321.,2011.
[11] Bieri N R,Chung J,Haferl S E,Poulikakos D,Grigoropoulos C P .Microstructuring by printing and laser curing of nanoparticle solutions[J].Applied Physics Letters,2003,82(20):3529-3531.,2003.
[12] Chung J W,Ko S W,Bier N R,Grigoropoulos C P,Poulikakos D .Conductor microstructures by laser curing of printed gold nanoparticle ink[J].Applied Physics Letters,2004,84(5):801-803.,2004.
[13] Dockendorf C P R,Choi T Y,Poulikakos D.Multilayer direct writing of electrical conductors with gold nanoinks using the fountain pen principle[C].ASME/Pacific Rim Technical Conference on Integration and Packaging of MEMS,NEMS,and Electronic,2005:1959-1961.,2005.
[14] Ko S H,Chung J,Choi Y,Fabrication of inkjet printed flexible electronics by low temperature subtractive laser processing[C].ASME International Mechanical Engineering Congress and Exposition,2005:599-603.,2005.
[15] Son Y,Yeo J,Ha C W,Lee J,Hong S,Nam K H,Yang D Y,Ko S H .Application of the specific thermal properties of Ag nanoparticles to high resolution metal patterning[J].Thermochimica Acta,2012,542
[16] Kumpulainen T,Pekkanen J,Valkama J,Laakso J,Tuokko R,Mantysalo M .Low temperature nanoparticle sintering with continuous wave and pulse lasers[J].Optics and Laser Technology,2010,43(3):570-576.,2010.
[17] Chiolerio A,Maccioni G,Martino P,Cotto M,Pandolfi P,Rivolo P,Ferrero S,Scaltrito L .Inkjet printing and low power laser annealing of silver nanoparticle traces for the realization of low resistivity lines for flexible electronics[J].Microelectrnic Engineering,2010,88(8):2481-2483.,2010.
[18] Gu W B,Lin J,Cui Z.Low temperature laser sintering of printed nano-silver electrodes for flexible electronics[C].Technical Proceedings of the 2012 NSTI Nanotechnology Conference and Expo,NSTI-Nanotech,2012:279-282.,2012.
[19] Lee D G,Kim D K,Moon Y J,Moon S J .Effect oflaserinduced temperature field on the characteristics of lasersintered silver nanoparticle ink[J].Nanotechnology,2013,24(26):9.,2013.
[20] Kang B,Kno J,Yang M .High-resolution and high-conductive electrode fabrication on a low thermal resistance flexible substrate[J].Journal of Micromechanics and Microengineering,2011,21(7):7.,2011.
[21] Peng P,Hu A,Zhou Y .Laser sintering of silver nanoparticle thin films:microstructure and optical properties[J].Applied Physics a Materials Science & Processing,2012,108(3):685-691.,2012.
[22] Ko S H,Pan H,Grigoropoulos C P,Luscombe C K,Frechet J M J,Poulikakos D .All-inkjet-printed flexible electronics fabrication on a polymer substrate by low temperature high resolution selective laser sintering of metal nanoparticles[J].Nanotechnology,2007,18(34):8.,2007.
[23] Ko S H,Chung J,Pan H,Grigoropoulos C P,Poulikakos D .Fabrication of multilayer passive and active electric components on polymer using inkjet printing and low temperature laser processing[J].Sensors and Actuators APhysical,2007,134(1):161-168.,2007.
[24] Hu M,Hartland G V .Heat dissipation for Au particles in aqueous solution:relaxation time versus size[J].Journal of Physical Chemistry B,2002,106(28):7029-7033.,2002.
[25] Son Y,Yeo J,Ha C W,Lee J,Hong S,Nam K H,Yang D Y,Ko S H .Application of the specific thermal proper ties of Ag nanoparticles to high-resolution metal patterning[J].Thermochimica Acta,2012,542
[26] Son Y,Yeo J,Moon H,Lim T W,Hong S,Nam K H,Yoo S,Grigoropoulos C P,Yang D Y,Ko S H .Nanoscale electronics:digital fabrication by direct femtosecond laser processing of metal nanoparticles[J].Advanced Materials,2011,23(28):3176-3181.,2011.
[27] Tobjork D,Aarnio H,Pulkkinen P,Bollstrom R,Maattanen A,Ihalainen P,Makela T,Peltonen J,Toivakka M,Tenhu H,Osterbacka R .IR sintering of ink-jet printed metal nanoparticles on paper[J].Thin Solid Films,2012,520(7):2949-2955.,2012.
[28] Cherrington M,Claypole T C,Deganello D,Mabbett I,Watson T,Worsley D .Ultrafast near-infrared sintering of a slot-die coated nano-silver conducting ink[J].Journal of Materials Chemistry,2011(21):7562-7564.,2011.
[29] Knischka R,Lehmann U,Stadler U,Mamak M,Benkhoff J .Novel approaches in NIR curing technology[J].Progress in Organic Coatings,2009,64(23):171-174.,2009.
[30] Watson T,Mabbett I,Wang H X,Peter L,Worsley D .Ultrafast near infrared sintering of TiO2 layers on metal substrates for dye-sensitized solar cells[J].Progress in Photovoltaics,2011,19(4):482-486.,2011.
[31] Kim H S,Dhage S R,Shim D E,Hahn H T .Intense pulsed light sintering of copper nanoink for printed electronics[J].Applied Physics A Materials Science & Processing,2009,97(4):791-798.,2009.
[32] Kang J S,Ryu J,Kim H S,Hahn H T .Sintering of inkjet-printed silver nanoparticles at room temperature using intense pulsed light[J].Journal of Electronic Materials,2011,40(11):2268-2277.,2011.
[33] Lee D J,Park S H,Jang S,Kim H S,Oh J H,Song Y W .Pulsed light sintering characteristics of inkjet-printed nanosilver films on a polymer substrate[J].Journal of Micromechanics and Microengineering,2011,21(12):7.,2011.
[34] Chung Wan-Ho,Hwang Hyun-Jun,Lee Seung-Hyun,Kim Hak-Sung .In situ monitoring of a flash light sintering process for silver nano ink for flexible electronics[J].Nanotechnology,2013,24(3):035202.,2013.
[35] Wang B Y,Yoo T H,Song Y W,Lim D S,Oh Y J .Cu ion ink for a flexible substrate and highly conductive patterning by intensive pulsed light sintering[J].ACS Applied Materials & Interfaces,2013,5(10):4113-4119.,2013.
[36] Ryu J,Kim H S,Hahn H T .Reactive sintering of copper nanoparticles using intense pulsed light for printed electronics[J].Journal of Electronic Materials,2011,40(1):42-50.,2011.
[37] Han W S,Hong J M,Kim H S,Song Y W .Multi-pulsed white light sintering of printed Cu nanoinks[J].Nanotechnology,2011,22(39):6.,2011.
[38] Hosel M,Krebs F C .Large-scale roll to-roll photonic sintering of flexo printed silver nanoparticle electrodes[J].Journal of Materials Chemistry,2012,22(31):15683-15688.,2012.
[39] Helgesen M,Carle J E,Andreasen B,Hosel M,Norrman K,Sondergaard R,Krebs F C .Rapid flash annealing of thermally reactive copolymers in a roll to roll process for polymer solar cells[J].Polymer Chemistry,2012,3(9):2649-2655.,2012.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
作者相关
文章评分
  • 您的评分：
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%

版权所有©2010中国科学院金属研究所中国科技出版传媒股份有限公司

本系统由北京仁和汇智信息技术有限公司设计开发

技术支持：info@rhhz.net