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利用超临界CO2发泡技术,制备了一种低介电常数的聚酰亚胺微孔薄膜.扫描电子显微镜观察表明,微孔薄膜具有实心表层及中心微孔层结构,中心微孔层内泡孔孔径约2 μm,泡孔分布均匀.在相同的发泡温度下,发泡时间在10 s内,随着发泡时间增长,孔径较小(<1μm)的泡孔数目明显减小,泡孔尺寸增大.发泡约10 s后,泡孔尺寸变化略微增加.在230℃~270℃范围内,发泡温度越高,微孔薄膜中心微孔层内的泡孔孔径越小,孔径分布越均匀,泡孔密度越大,薄膜密度也越小.拉伸性能测试表明,随着密度减小,聚酰亚胺微孔薄膜的拉伸强度和拉伸模量下降.介电性能分析表明,聚酰亚胺微孔薄膜的介电常数明显下降,当密度为0.75 g/cm3时,聚酰亚胺微孔薄膜的介电常数降至2.21;在102 Hz~107 Hz频率范围内,微孔薄膜的介电常数具有较高的频率稳定性.

参考文献

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