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从工艺配方和工艺条件、结合力、电流密度范围、分散能力,沉积速率、深镀能力、孔隙率和阴极电流效率比较了预镀镍、无氰碱性预镀铜、酸性预镀铜,氰化预镀铜四种钢铁表面的预镀工艺的性能特点.

The performance and characteristics of four kinds of pre-plating processes including nickel pre-plating, cyanide-free alkaline copper pre-plating, acid copper pre-plating and cyanide copper pre-plating were compared with respect to the process formulations and conditions, adhesion strength, current density range, throwing power, deposition rate, covering power, porosity and cathodic current efficiency.

参考文献

[1] 徐金来,邓正平,赵国鹏,胡耀红,张晓明.无氰碱性镀铜工艺实践[J].电镀与涂饰,2008(03):7-8.
[2] 袁诗璞.路漫漫兮,无氰碱铜[J].电镀与涂饰,2006(08):51-53.
[3] 胡信国.一步法无氰镀铜的五年生产应用及工艺稳定性的进一步研究[J].电镀与精饰,1983(03):25.
[4] 温青,陈建培.无氰碱性镀铜工艺的研究进展[J].材料保护,2005(04):35-37.
[5] 章葆澄.电镀工艺学[M].北京:北京航守航天大学出版社,1993
[6] 张景双;石金声;石磊.电镀溶液与镀层性能测试[M].北京:化学工业出版社,2003
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