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超低介电常数纳米多孔SiO2薄膜在未来超大规模集成电路(ULSI)中有着广阔的应用前景,但其疏水性能的好坏是决定其能否在ULSI中应用的重要因素之一.介绍了国内外有关纳米多孔SiO2薄膜疏水性的原理、工艺以及表征方法.

参考文献

[1] 丁士进 .低介电常数介质薄膜及其金属化研究[D].复旦大学,2001.
[2] Jo MH.;Kim DJ.;Hyun SH.;Choi SY.;Paik JT.;Park HH. .SIO2 AEROGEL FILM AS A NOVEL INTERMETAL DIELECTRIC[J].Journal of Applied Physics,1997(3):1299-1304.
[3] 阮刚,肖夏,朱兆旻.低介电常数(low-k)介质在ULSI中的应用前景[J].电子学报,2000(11):84-87,95.
[4] Hyun S.H.;Kim J.J. .Synthesis and Characterization of Low-Dielectric Silica Aerogel Films[J].Journal of the American Ceramic Society,2000(3):533-540.
[5] Nobuyuki Kawakami;Yoshito Fukumoto;Takashi Kinoshita et al.Preparation of highly porous silica aeragel thin film by supercritical drying[J].Japanese Journal of Applied Physics Part 2,2000(03):L182.
[6] Jung SB.;Park HH. .Control of surface residual -OH polar bonds in SiO2 aerogel film by silylation[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2002(0):503-507.
[7] Akira Nakajima;Kazuhito Hashimoto;Toshiya Watanabe .Recent Studies on Super-Hydrophobic Films[J].Monatshefte fur Chemie,2001(1):31-41.
[8] 邵颖惠,刘郁杨.Sol-Gel法制备IPN防雾涂层及其性能研究Ⅰ.甲醛改性PVA/有机硅体系[J].功能高分子学报,2000(02):137-140.
[9] 翟锦,李欢军,李英顺,李书宏,江雷.碳纳米管阵列超双疏性质的发现[J].物理,2002(08):483-486.
[10] 山边正显.含氟材料的研究与开发[M].上海:华东理工大学出版社,2003:87.
[11] Yang HS;Choi SY;Hyun SH;Park HH;Hong JK .Ambient-dried low dielectric SiO2 aerogel thin film[J].Journal of Non-Crystalline Solids: A Journal Devoted to Oxide, Halide, Chalcogenide and Metallic Glasses, Amorphous Semiconductors, Non-Crystalline Films, Glass-Ceramics and Glassy Composites,1997(2/3):151-156.
[12] 姚兰芳,解德滨,肖轶群,沈军,吴广明,王珏.疏水型纳米SiO2增透薄膜的制备与性能研究[J].材料科学与工程学报,2004(04):502-504.
[13] 姚兰芳,沈军,吴广明,王珏.常压下低折射率纳米多孔二氧化硅薄膜的制备[J].同济大学学报(自然科学版),2003(09):1123-1126.
[14] 王娟,张长瑞,冯坚.三甲基氯硅烷对纳米多孔二氧化硅薄膜的修饰[J].物理化学学报,2004(12):1399-1403.
[15] Venkateswara Rao A;Ravindra Kalesh .Comparative studies of the physical and hydrophobic properties of TEOS based silica aerogels using different co-precursors[J].Science and Technology of Advanced Materials,2003,4:509.
[16] Kim JJ.;Hyun SH.;Park HH. .The effects of plasma treatment on SiO2 aerogel film using various reactive (O-2, H-2, N-2) and non-reactive (He, Ar) gases[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2000(0):525-529.
[17] Kim H R;Park H H;Hyun S H et al.Effect of O2 plasma treatment on the properties of SiO2 aerogel film[J].Thin Solid Films,1998,332:444.
[18] 许岗,杨觉明,陈平.疏水复合薄膜接触角的测定[J].西安工业学院学报,2004(01):65-69.
[19] 赵英健 .有机改性硅溶胶及疏水薄膜的制备研究[D].长沙:国防科技大学,2004.
[20] A. Venkateswara Rao;manish M. Kulkarni .Hydrophobic properties of TMOS/TMES-based silica aerogels[J].Materials Research Bulletin: An International Journal Reporting Research on Crystal Growth and Materials Preparation and Characterization,2002(9):1667-1677.
[21] Li Xiaochun;Terence A King .Spectroscopic studies of solgel-derived organically modified silicates[J].Journal of Non-Crystalline Solids,1996,204:235.
[22] Gu Guotuan;Zhang Zhijun;Dang Hongxin .Preparation and characterization of hydrophobic organic-inorganic composite thin films of PMMA/SiO2/TiO2 with low friction coefficient[J].Applied Surface Science,2004,221:129.
[23] He ZW;Zhen CM;Liu XQ;Lan W;Xu DY;Wang YY .Microstructural characterization of low dielectric silica xerogel film[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2004(0):168-171.
[24] Yang H S;Choi S Y;Hyun S H et al.Ambeint-dried SiO2aerogel thin films and their dielectric application[J].Thin Solid Films,1999,348:69.
[25] Kim JH.;Park HH.;Hyun SH.;Jung SB. .The effects of pre-aging and concentration of surface modifying agent on the microstructure and dielectric properties of SiO2 xerogel film[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2000(0):467-472.
[26] Hong J K;Kim H R;Park H H .The effect of sol viscosity on the sol-gel derived low density SiO2 xerogel film for in termetal dielectric application[J].Thin Solid Films,1998,332:449.
[27] G. Celichowski;I. Piwonski;M. Cichomski;K. Koralewski;S. Plaza;W. Olejniczak;J. Grobelny .The influence of methyl group content on tribological properties of organo-silica thin films[J].Tribology letters,2003(3):181-185.
[28] 杨大祥 .纳米多孔氧化硅薄膜的制备工艺、结构及性能研究[D].长沙:国防科技大学,2003.
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