用Al/Ti/Al复合层作连接材料,通过连接温度下原位生成金属间化合物真空连接Si3N4陶瓷.研究了Al与Ti的厚度匹配和工艺参数对接头显微组织及其强度的影响和接头的形成过程.结果表明:当原位生成的连接层金属组织为Al3Ti/Ti/Al3Ti时,由于纯金属间化合物Al3Ti脆性大,且其与剩余Ti片的结合强度低,陶瓷接头强度低;当连接层金属组织为大量Al3Ti颗粒加少量Al基固溶体时,连接层金属能获得良好的强化效果,与用纯Al连接的接头相比,接头室温和高温强度显著提高.Al与Ti的厚度匹配和连接参数适当时,接头室温和600℃剪切强度可分别达到89.4 MPa和29.7MPa.
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