欢迎登录材料期刊网

材料期刊网

高级检索

The reactive spread behaviour of Cu particles on the surJace of Al has been studied.The role of oxide film and the .formation mechanism of the joint during Al/Cu contacting reaction brazing have been discussed.

参考文献

[1]
[2]
[3]
[4]
[5]
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%