研究了Sn-3.5Ag-0.75Cu和Sn-0.75Cu焊料合金在 NaCl-Na2SO4-Na2CO3模拟土壤溶液中的腐蚀浸出行为，并与Sn-37Pb焊料合金的腐蚀浸出行为对比分析。研究表明，这3种焊料合金中Sn的浸出量随时间的延长趋于平缓，且Sn-0.75Cu焊料合金中Sn的浸出量最高，添加Ag元素后明显抑制了Sn-3.5Ag-0.75Cu焊料合金中Sn的浸出；Ag，Cu，Pb的浸出量随时间的延长呈线性增加，且Ag，Cu的浸出量较少。3种焊料合金浸出后表面产物层较厚，主要由 Sn4(OH)6Cl2和SnO组成，其中Sn-0.75Cu焊料合金的表面产物层有裂纹和孔洞，Sn-3.5Ag-0.75Cu焊料合金的表面产物相对致密，而Sn-37Pb焊料合金的表面产物局部出现剥落现象。这3种焊料合金浸出动力学行为存在差异，主要与表面产物的相组成和形貌有关。
Leaching behavior of Sn-3.5Ag-0.75Cu and Sn-0.75Cu lead-free solder alloys in a NaCl-Na2SO4-Na2CO3 mixed solution as simulated soil was investigated and compared with that of Sn-37Pb alloy. The results showed that leaching amount of Sn from the three solders increased with reaction period. The most leaching amount of Sn was found for Sn-0.7Cu solder alloy. However, Sn leached from Sn-3.5Ag-0.75Cu solder alloy was depressed by adding Ag element. The leaching amount of Ag, Cu and Pb elements also increased linearly with increasing time. However, the relatively less amount of leached Ag and Cu was measured. The product on the leached solder alloy surface was identified as Sn4(OH)6Cl2 and SnO. Many cracks and pits were found in the product on Sn-0.75Cu alloy surface, while the product layer on Sn-3.5Ag-0.75Cu alloy was rather compact. For Sn-37Pb alloy, some product had spalled from the surface. Based on the experimental results, it was supposed that the phase formation and morphology of surface product were responsible for the difference of leaching kinetics for these three solder alloys.
参考文献
| [1] |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%