陶瓷表面经传统钯液活化后化学镀铜层的结合力受Sn2＋的影响，且操作麻烦，污染环境，生产成本高。为此，制备了具有催化活性的金纳米液，并将其用于陶瓷化学镀铜前的活化。通过SEM，EDS，XRD及结合力测试讨论了镀液成分、温度及装载量对沉积速度的影响，确定了金纳米活化陶瓷后的最佳化学镀铜工艺参数，并将其与传统钯活化陶瓷化学镀铜进行了对比。结果表明：陶瓷基体经金纳米活化后进行化学镀铜，可以得到更加致密均匀、结合力好的镀层。
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