采用离散元法(DEM),用BPM(Bonded-particle model)模型分别建立并校准SiC陶瓷基体和碳纤维离散元模型,采用位移软化接触模型表征层间和纤维/基体之间的界面元损伤双线性本构关系.通过DCB试验(Double cantilever beam virtual test)和微滴脱黏试验分别对其界面强度进行收敛试验,动态地观察了塑性变形、裂纹扩展及界面脱黏过程.结果表明,位移软化接触模型可以很好地表征界面损伤过程,采用离散元法可以很好地动态模拟较复杂复合材料的损坏过程.
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