采用直流反应磁控溅射方法在AISI304不锈钢和Si(100)表面沉积了TiN薄膜,利用场发射扫描电镜、X射线衍射仪和电化学技术研究了基体温度对TiN薄膜结构与电化学性能的影响.结果表明:TiN薄膜为柱状结构,表面平整、致密,但基体温度高于300℃时膜表面存在微裂纹.薄膜为面心立方结构δ-TiN并存在择优取向,室温和150℃时的薄膜择优取向为(111)晶面,300℃和450℃时为(200)晶面;基体为室温时薄膜厚度为0.63 μm,温度提高到150℃后膜厚增加到1μm左右,但继续升温对膜厚影响并不明显.薄膜在NaCl溶液中的腐蚀为点蚀,基体温度为150℃时的TiN薄膜具有最高的开路电位和点蚀电位以及最低的腐蚀速率,因此具有最佳的耐蚀性.
参考文献
| [1] | J. Musil;J. Vlcek .A perspective of magnetron sputtering in surface engineering[J].Surface & Coatings Technology,1999(1/3):162-169. |
| [2] | Subrsmanian B;Ashok K;Jayachandran M .Effect of substrate temperature on the structural properties of magnetron sputtered titanium nitride this films with brush plated nickel interlayer on mild steel[J].Applied Surface Science,2008,255(05):2133-2138. |
| [3] | Benegra M;Lamas DG;de Rapp MEF;Mingolo N;Kunrath AO;Souza RM .Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2006(1/2):146-150. |
| [4] | Polyakova IG.;Hubert T. .Thermal stability of TiN thin films investigated by DTG/DTA[J].Surface & Coatings Technology,2001(1):55-61. |
| [5] | Patsalas P;Charitidis C;Logothetidis S .The effect of substrate temperature and biasing on the mechanical properies and structure of sputtered titanium nitride thin films[J].Surface and Coatings Technology,2000,125(1-3):335-340. |
| [6] | Roman D;Bernardi J;Amorim C.Effect of deposition temperature on microstructure arid corrosion reaistance of ZrN thin films dePosited by DC reactive magnetron sputtering[J].Materials Chemistry and Physics,2011 |
| [7] | Corrosion behavior of TiN-coated stainless steel as bipolar plate for proton exchange membrane fuel cell[J].International journal of hydrogen energy,2010(8):3721. |
| [8] | Liu C;Bi Q;Matthews A .EIS comparison on corrosion performance of PVD TiN and CrN coated mild steel in 0.5N NaCl aqueous solution[J].Corrosion Science,2001,43(10):1953-1961. |
| [9] | Lee D N .A model for development of orientation of vapor deposits[J].Journal of Materials Science,1989,24(03):4375-4378. |
| [10] | 李瑛,屈力,王福会,邵忠宝.TiN涂层电化学腐蚀行为研究Ⅰ.TiN涂层的保护性能与失效机制[J].中国腐蚀与防护学报,2003(02):65-69. |
| [11] | 李莎,阎殿然,董艳春,王师,高国旗,张志彬.反应等离子喷涂TiN涂层电化学腐蚀行为[J].北京科技大学学报,2009(09):1147-1151. |
| [12] | Sundgren J E;Johansson B O;Hentzell H et al.Mechanisms of reactive sputtering of titanium nitride and titanium carbide Ⅱ:Morphology and structure[J].Thin Solid Films,1983,105(04):367-384. |
| [13] | Bhaduri, D.;Ghosh, A.;Gangopadhyay, S.;Paul, S. .Effect of target frequency, bias voltage and bias frequency on microstructure and mechanical properties of pulsed DC CFUBM sputtered TiN coating[J].Surface & Coatings Technology,2010(21/22):3684-3697. |
| [14] | 朱福如;许兰萍;张德元.不锈钢表面耐蚀涂层研究[J].国外金属热处理,1997(增刊):39-43. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%