研究了不同固溶工艺条件对Cu-1.4Ni-1.2Co-0.6Si合金显微组织的影响,对合金固溶-时效后的显微硬度和导电率进行了分析,并采用电子衍射及透射电镜分析其显微组织.结果表明:合金铸态组织以等轴晶为主,热轧变形组织中存在许多细小析出相.热轧合金在固溶处理过程中基体变形组织发生再结晶和晶粒长大,且随着固溶温度升高,析出相固溶量增加,至975℃时,析出相粒子基本回溶到基体中.合金中的析出相与Cu-Ni-Si合金具有相同的结构和形貌,与Cu基体的位向关系为:[001]Cu//[(1)10]p,(010)Cu//(001)p;[(1)12]Cu//[32(4)]p,(110)Cu//(2 (1)1)p.合金最佳固溶-时效处理工艺为975℃×1.5h+500℃×4 h时效,在此工艺条件下,合金显微硬度为232 HV,相对导电率为49％IACS.
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