铝电解电容器因其成本低廉、存储电容量高而广泛应用于各种各样的电子设备中.市场化经济的快速发展对铝电解电容器的小型化、高比容、低成本、高频低阻抗等性能要求日益激烈.根据电容器的结构特点可知提高铝电解电容器高性能的关键技术就是要提高阳极铝箔的比表面积.本文从铝原箔的质量包括化学成分、组织结构、表面质量,以及腐蚀技术包括改进工艺、添加缓蚀剂、采用模板控制等方面,总结目前科学家在提高铝电解电容器用阳极箔比表面积研究工作的进展.
参考文献
| [1] | 冯哲圣,陈金菊,徐蓓娜,杨邦朝.铝电解电容器技术现状及未来发展趋势[J].电子元件与材料,2001(05):30-32. |
| [2] | 高亢之.电解电容器用铝箔概述[J].轻合金加工技术,2000(11):9-15. |
| [3] | 王银华,杜国栋,许金强,杨军,王建中.中高压铝电解电容器阳极箔研究进展[J].电子元件与材料,2006(06):1-5. |
| [4] | Thierry Martin;Kurt R. Hebert .Atomic Force Microscopy Study of Anodic Etching of Aluminum[J].Journal of the Electrochemical Society,2001(2):B101-B109. |
| [5] | 肖仁贵,闫康平,严季新,王建中.高纯铝光箔化学成分对直流电侵蚀的影响[J].电子元件与材料,2007(08):52-54. |
| [6] | 毛卫民,杨宏,余永宁,冯惠平,徐进.微量Mg对高压电子铝箔腐蚀结构的影响[J].中国有色金属学报,2003(05):1057-1060. |
| [7] | SONG Jing-bo,MAO Wei-min,YANG Hong,FENG Hui-ping.Effect of trace Sn on corrosion behaviors of high voltage anode aluminum foil[J].中国有色金属学会会刊（英文版）,2008(04):879-883. |
| [8] | WANG Haiyan,LI Wenxue,REN Huiping,HUANG Liying,WANG Xiangyang.Effect of cerium addition on microstructure and texture of aluminum foil for electrolytic capacitors[J].稀土学报（英文版）,2010(01):134-137. |
| [9] | 李文学,华连庚,李德超.稀土铝箔再结晶退火组织、织构研究[J].轻合金加工技术,2010(11):17-20. |
| [10] | Engler O;Huh MY .Evolution of the cube texture in high purity aluminum capacitor foils by continuous recrystallization and subsequent grain growth[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,1999(1/2):371-381. |
| [11] | 左宏,毛卫民,冯惠平.强立方织构超薄型高压阳极铝箔的研制及检测[J].物理测试,2005(02):16-18. |
| [12] | 黄涛,曲家惠,高明,王福,左良.异步轧制速比对高纯铝箔织构转变的影响[J].中国有色金属学报,2006(01):110-115. |
| [13] | 王磊,翟新生,刘杨,左良.异步轧制对高压电解电容器用铝箔织构的影响[J].东北大学学报（自然科学版）,2011(02):245-249. |
| [14] | 张新明,蒋红辉,肖亚庆,陈志永,刘楚明,周卓平.润滑剂对高纯铝形变织构的影响[J].中国有色金属学报,2001(05):785-790. |
| [15] | WU Yan,ZHAO Xiang,HE Chang-shu,ZHAO Zhi-peng,ZUO Liang,C. ESLING.Effects of electric field on recrystallization texture evolution in cold-rolled high-purity aluminum sheet during annealing[J].中国有色金属学会会刊(英文版),2007(01):143-147. |
| [16] | Ozgul Keles;Murat Dundar .Aluminum foil: Its typical quality problems and their causes[J].Journal of Materials Processing Technology,2007(1/3):125-137. |
| [17] | 郑红梅,吴玉程,黄新民,胡学飞,刘勉诚,杨蓓蓓.铝电解电容器用电子铝箔的性能分析与比较[J].功能材料与器件学报,2012(01):10-16. |
| [18] | Anawati;Heidi Nordmark;Spyros Diplas .Surface Segregation of Trace Element Bismuth during Heat Treatment of Aluminum[J].Journal of the Electrochemical Society,2012(3):C137-C145. |
| [19] | Chiu Yi Hung;Ou Bin Lung;Lee Yuoh Lien .Effect of acid concentration and current density on DC etching of aluminum electrolytic capacitor foil[J].The Korean journal of chemical engineering,2007(5):881-887. |
| [20] | Tatsuro Fukushima;Kazuyuki Nishio;Hideki Masuda .Optimization of Etching Conditions for Site-Controlled Tunnel Pits with High Aspect Ratios in Al Foil[J].Journal of the Electrochemical Society,2010(4):C137-C139. |
| [21] | Lee YL;Ou BL;Chiu YH .Effect of frequency and current density on AC etching of aluminum electrolytic capacitor foil[J].Journal of Materials Science. Materials in Electronics,2007(6):627-634. |
| [22] | 冯哲圣,杨邦朝,李建军.日本铝电极箔制造技术研究的新进展[J].电子元件与材料,2001(02):23-25,27. |
| [23] | 班朝磊,何业东.高压电子铝箔阳极电解扩孔行为[J].中国有色金属学报,2008(12):2190-2195. |
| [24] | Rengui Xiao;Kangping Yan .Tunnel Morphology Of Aluminum Foil Etched By A Two-step Dc Etching Method[J].Corrosion Science: The Journal on Environmental Degradation of Materials and its Control,2008(11):3256-3260. |
| [25] | 杨富国.缓蚀剂对提高腐蚀箔比容的影响[J].电子元件与材料,2010(07):54-56. |
| [26] | 闫康平,王建中,严季新.中高压电容器铝箔扩孔液中缓蚀剂的作用[J].电子元件与材料,2001(06):6,9. |
| [27] | Ryu JH;Seo JH;Jeong JH;Kim SK;Lee DN .The effect of aluminum ions on the DC etching of aluminum foil[J].Journal of Applied Electrochemistry,2004(9):879-884. |
| [28] | Kazuyuki Nishio;Kenji Kanezawa;Hideki Masuda .Control of Anisotropic Tunnel Etching of Al by Indentation[J].Chemistry Letters,2006(10):1096-1097. |
| [29] | Hideki Masuda;Minoru Tajima;Kazuyuki Nishio .Site Control of Tunnel Etching of Al for Electrolytic Capacitors Using Pretexturing by Mold[J].Chemistry Letters,2002(11):1150-1151. |
| [30] | Formation of aluminum tunnel pits arrayed using SU-8 masks with UV-assisted thermal imprint lithography[J].Microelectronic engineering,2010(12):2610-2613. |
| [31] | Hwa-Sun Park;Chang-Hyoung Lee;Hyung-Joon Cho;Tae-Yoo Kim;Su-Jeong Suh .Formation of uniform square-shaped tunnel pit by electrochemical etching with an opened polyimide layer on aluminum foil[J].Surface and Interface Analysis: SIA: An International Journal Devoted to the Development and Application of Techniques for the Analysis of Surfaces, Interfaces and Thin Films,2012(11/12):1423-1426. |
| [32] | Hidetaka Asoh;Koji Nakamura;Sachiko Ono .Control of pit initiation sites on aluminum foil using colloidal crystals as mask[J].Electrochimica Acta,2007(1):83-86. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%