研究了多组元无铅钎料Sn-2Cu-0.5Ni和Sn-2Cu-0.5Ni-0.5Au的熔化行为、微观组织、力学性能及与Ni基板的钎焊反应.结果表明:Au的引入降低了钎料合金的熔化温度:2种钎料基体中的金属间化合物(IMC)均基于Cu6Sn5结构,且在260℃下与Ni基板钎焊60 s后在接头界面处均生成棒状的(Cu,Ni)6Sn5;通过拉伸试验得到了2种钎料的抗拉强度和延伸率.
参考文献
| [1] | 马鑫,董本霞.无铅钎料发展现状[J].电子工艺技术,2002(02):47-52. |
| [2] | 胡志田,何前进,徐道荣.无铅软钎料国内外的研究动态与发展趋势[J].焊接技术,2005(03):4-7. |
| [3] | Frear D R;Jang J W;Lin J K et al.[J].JOM-Journal of the Minerals Metals and Materials Society,2001,53(06):28. |
| [4] | Brodley E;Bath J;Whitten G et al.[J].Advanced Packaging,2000,9(02):34. |
| [5] | Sharif Ahmed;Chan Y C .[J].Materials Science and Engineering B:Solid State Materials for Advanced Technology,2004,106(02):126. |
| [6] | Shiau L C;Ho C E;Kao C R .[J].Soldering & Surface Mount Technology,2002,14(03):25. |
| [7] | Islam MN;Chan YC .Interfacial reactions of Sn-Cu solder with Ni/Au surface finish on Cu pad during reflow and aging in ball grid array packages[J].Materials Science & Engineering, B. Solid-State Materials for Advanced Technology,2005(3):246-253. |
| [8] | Park J Y;Yang C W;Ha J S et al.[J].Journal of Electronic Materials,2001,30(09):1165. |
| [9] | Abtew M;Selvaduray G .[J].Materials Science and Engineering,2000,27:95. |
| [10] | Duan N;Scheer J;Bielen J et al.[J].Microelectronica Reliability,2003,43(08):1317. |
| [11] | 晏勇,蒋晓虎,张继忠,徐建洋.一种高性能实用型Sn-Cu无铅电子钎料[J].电子元件与材料,2005(04):54-56. |
| [12] | Chen WT.;Ho CE.;Kao CR. .Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders[J].Journal of Materials Research,2002(2):263-266. |
| [13] | Yu DQ;Wu CML;He DP;Zhao N;Wang L;Lai JKL .Effects of Cu contents in Sn-Cu solder on the composition and morphology of intermetallic compounds at a solder/Ni interface[J].Journal of Materials Research,2005(8):2205-2212. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%