利用Baker模型和弹塑性有限元方法研究了胶接接头搭接区残余应力的分布.结果表明,因胶粘荆的线膨胀系数比被粘物高得多,胶层固化时被粘物阻碍了胶层的收缩,故胶层中为残余拉伸应力,被粘物中为残余压缩应力,胶层中的残余应力远大于被粘物中的残余应力.利用Baker模型和有限元计算远离自由端的胶层中的残余应力,两者吻合.被粘物中的残余应力呈中心对称,等效应力经多项式拟合后呈抛物线分布.
The Baker model and elasto-plastic finite element method(FEM) are applied to investigate the thermal stress distribution in over lap zone of the single lap joint. The results obtained show that tensile stress in the adhesive and residual compressive stress in the adherend as big difference of thermal coefficient of expansion between the two materials. The results of theoretical calculation and numerical investigation on the thermal stress distribution in the adhesive away from the end are anastomotic. The residual stress in the adherend is center symmetric, and the polynomial fitting of the S_(eqv) is obtained as parabola distribution.
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