软刻蚀技术是基于传统光刻蚀技术提出的一系列技术,包括微模塑、转移微模塑和毛细微模塑等,其共同特点是利用弹性模作为微结构转移元件,复制其他方法制备的原始模板的微结构,再用此弹性模进行微结构的成形.因其成本低廉、操作过程简单,为陶瓷微器件的制备提供了一种先进的净成形加工技术.其工艺步骤主要包括:弹性模的制备、浆料或陶瓷预聚体的制备、注模、干燥(交联固化)、脱模和烧结.本文按照制备工艺综述了软刻蚀技术成形陶瓷微器件的研究进展,着重讨论了影响微成形的关键因素,并对将来的研究方向进行了展望.
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