简要介绍了集成电路的发展趋势及其带来的相关问题和解决办法.综述了国内外对Cu互连扩散阻挡层的制备方法与工艺、阻挡层的选材、阻挡层薄膜的特性等最新研究的进展.评述了该领域的发展趋势及可能的影响因素.
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