通过同步测量约束加热和冷却过程中合金的电阻率和回复应力与温度的关系, 对Fe--Mn--Si--Cr--Ni形状记忆合金约束下的转变过程进行了详细研究. 结果表明,变形约束加热后的冷却过程中, 回复应力随温度降低而增加. 当回复应力增加到大于合金的屈服强度时, 将首先发生塑性变形；然后随温度的进一步降低, 回复应力到达应力诱发ε马氏体相变的临界应力时, 回复应力将诱发ε马氏体相变, 导致回复应力随温度的降低而下降. 塑性变形和应力诱发ε马氏体相变都将显著松弛回复应力, 降低合金冷却到室温时的回复应力. 建立了合金加热和冷却过程中回复应力的方程.提出了该记忆合金管接头成分设计原则.
Phase transformation behavior of the constrained Fe--Mn--Si--Cr--Ni shape memory alloy has been studied in detail through measuring the resistance and the recovery stress as afunction of temperature simultaneously during heating and cooling. On cooling, the recoverystress increases with lowering temperature. At the temperature that the recovery stress isgreater than the yield strength, plastic deformation will first take place. With the further decreaseof the temperature, the ε martensite will be induced by the recovery stress at the temperature thatthe recovery stress reaches to the critical stress for stress--inducedεmartensite. Below this temperature, the recovery stress decreases with loweringtemperature. The above plastic deformation and the εmartensitic transformation induced by the recovery stress drastically relaxthe recovery stress. The recovery stress equations during heating and cooling have beenestablished respectively. The design principle of compositions for Fe--Mn--Si--Cr--Ni shape memory alloys pip couplings has been put forward.
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| [3] | |
| [4] | |
| [5] |
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