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对新型耐370℃聚酰亚胺树脂的化学反应特性、流变性能进行了测试分析,着重研究了加压时机和后固化工艺参数对复合材料性能的影响,并在试验基础上制定了复合材料的固化工艺和后固化工艺.试验结果表明,复合材料的成型时选择280~300℃施加压力,有利于低孔隙率高质量,选择400℃和6h的后固化工艺参数较合理.树脂的最低黏度为100Pa.s,复合材料的Tg达到417℃,Td5%为545℃(空气中),370℃时弯曲强度为1010MPa,弯曲模量为116GPa,短梁剪切强度为43MPa.

The chemical reaction characterization,rheological property of novel polyimide were analyzed.The influence of time putting pressure on prepregs on properties of composites were researched.The cure and post-cure procedure were established based on experimentations.The result showed that the time putting pressure on prepregs is 280℃~300℃,postcure temperature and time are 400℃ and 6hrs,respectively,the minimum viscosity of the neat resin is 100Pa.s,the glass transition temperature,Td5%in air,the flexural strength,the moduli and the interlaminate of the polyimide matrix composite are 417℃,454℃,1010MPa,116GPa and 43.8MPa,respectively.

参考文献

[1] Kathy C.Chuang;Cheryl L.Bowman;Thomas K.Tsotsis;Cory P.Arendt .6F-Polyimides with Phenylethynyl Endcap for 315-370deg C Applications[J].High performance polymers,2003(4):459-472.
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[4] 曲希明,冀棉,赵伟栋,范琳,杨士勇.耐371℃ PMR型含异构联苯结构的聚酰亚胺树脂及复合材料[J].宇航材料工艺,2009(02):50-53.
[5] 孟祥胜,杨慧丽,范卫锋,王震.高韧性异构聚酰亚胺树脂及其复合材料[J].宇航材料工艺,2009(03):53-57.
[6] Fang XM.;Simone CD.;Stevens MP.;Scola DA.;Xie XQ. .A solid-state C-13 NMR study of the cure of C-13-labeled phenylethynyl end-capped polyimides[J].Macromolecules,2000(5):1671-1681.
[7] 赵伟栋,耿东兵,敖明.耐371℃PMR-Ⅱ型聚酰亚胺树脂化学反应特性的研究[J].宇航材料工艺,2001(05):44-48.
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