无铅焊料的腐蚀性能研究现状及展望

中国腐蚀与防护学报, 2011, 31(4): 250-254.

无铅焊料的腐蚀性能研究现状及展望

1.1. State Key Laboratory for Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 1100162. State Key Laboratory of Environment Adaptability for Industrial Products, China National Electric Apparatus Research Institute, Guangzhou 510300>

基金项目: 广州电器科学研究院工业产品环境适应性国家重点实验室资助

关键词：无铅焊料 , corrosion , oxidation

CURRENT STATUS AND FUTURE OF RESEARCH ON CORROSION FOR LEAD-FREE SOLDER MATERIALS

WANG Mingna , WANG Jianqiu , FENG Hao , KE Wei

Keywords： lead-free solder , 腐蚀 , 氧化

就Sn-Ag、Sn-Cu、Sn-Ag-Cu和Sn-Zn几种主要的无铅焊料合金系阐述了当前对无铅焊料腐蚀性能的研究情况。指出当前研究只关注了焊料本体的腐蚀性能，而在焊接过程中焊料熔化和凝固后的微观结构和化学等将发生变化，这些对腐蚀有很大影响。提出进一步研究应关注实际焊点与服役环境的交互作用机制。。

Corrosion performance of Sn-Ag, Sn-Cu, Sn-Ag-Cu and Sn-Zn lead-free solders are examined in this paper. The previous investigations were only focused on the solder itself, however, during the soldering process the solder was melted and then solidified. Compared to original solder material, the microstructure and chemistry of the solidified solder may change, which will affect the corrosion behavior of the solder during service in aggressive environment. So the investigation in the future should focus on the corrosion behavior of the solder joint used in aggressive environment.

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