导电胶的粘接可靠性是制约其应用的主要影响因素.综述了导电胶粘接的可靠性试验,讨论了导电胶的氧化/腐蚀、裂缝和分层、蠕变以及其它工艺缺陷等主要粘接失效机理,同时还提出了导电胶粘接可靠性评价中存在的主要问题,讨论了其粘接可靠性的定量评价.
参考文献
| [1] | 鲜飞.导电胶粘剂的研究现状[J].粘接,2001(05):37-38. |
| [2] | 陈党辉,顾瑛,陈曦.国外微电子组装用导电胶的研究进展[J].电子元件与材料,2002(02):34-39. |
| [3] | 高艳茹,李小兰.电子元器件表面组装用导电胶粘剂[J].绝缘材料通讯,2000(01):23-25. |
| [4] | 张军,陈旭.各向异性导电胶粘接可靠性研究进展[J].电子元件与材料,2004(01):35-38. |
| [5] | Li H Y;Moon K S;Yi Li.Reliability enhancement of electrically conductive adhesives in thermal shock environment[J].Electronic Components and Technology 2004 ECTC 04Proceedings 1-4 June,2004:165. |
| [6] | Périchaud M G;Delétage J Y;Frémont H et al.Reliability evaluation of adhesive bonded SMT components in industrial applications[J].Microelectronics Reliability,2000,40:1227. |
| [7] | Liu J.;Gustafsson K. .Surface characteristics, reliability, and failure mechanisms of tin/lead, copper, and gold metallizations[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1997(1):21-30. |
| [8] | Rainer D;Harry B;Thomas F et al.Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism[J].IEEE Transactions on Components Packaging and Manufacturing Technology,2000,23:462. |
| [9] | Rorgren R.S.;Johan Liu .Reliability assessment of isotropically conductive adhesive jointsin surface mount applications[J].IEEE transactions on components, packaging, and manufacturing technology.Part B.Advanced packaging,1995(2):305-312. |
| [10] | Li H Y;Moon K S;Li Y.Physical properties and thermocycling performance of electrically conductive adhesives (ECAs)modified by flexible molecules[A].,2004:45. |
| [11] | Li L;Morris J E;Liu J.Reliability and failure mechanism of conductive adhesives joints[A].,1995:114. |
| [12] | Tan C W;Chan Y C;Yeung N H .Effect of autoclave test on anisotropic conductive joints[J].Microelectronics Reliability,2003,43:279. |
| [13] | Tan C W;Siu Y M;Lee K K.Fabrication of smart card using UV curable anisotropic conductive adhesive (ACA) Part Ⅱ: Reliability performance of the ACA joints[A].,2004:140. |
| [14] | Michael Z;Julie H;Holly R .Electrically conductive adhesives for sueface mount solder replacement[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1996,19:241. |
| [15] | J.H. Zhang;Y.C. Chan;M.O. Alam;S. Fu .Contact resistance and adhesion performance of ACF interconnections to aluminum metallization[J].Microelectronics and reliability,2003(8):1303-1310. |
| [16] | Chan Y C;Hung K C;Tang C W.Degradation mechanisms of the anisotropic for flip chip on flex applications[C].Proceedings of 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing,2000:141. |
| [17] | Xu S Y;David A D;John G D .Environmental aging effects on the durability of electrically conductive adhesive joints[J].International Journal of Adhesion and Adhesives,2003,23:235. |
| [18] | Jannes C. Jagt .Reliability of electrically conductive adhesive joints for surface mount applications: a summary of the state of the art[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,1998(2):215-225. |
| [19] | Seppl A;Ristolainen E .Study of adhesive flip chip bonding process and failure mechanisms of ACA joints[J].Microelectronics Reliability,2004,44:639. |
| [20] | J. (Hans) de Vries .Failure Mechanism of Anisotropic Conductive Adhesive Interconnections in Flip Chip ICs on Flexible Substrates[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2004(1):161-166. |
| [21] | 吴丰顺,吴懿平,邬博义,陈力.倒装芯片各向异性导电胶互连的剪切结合强度[J].半导体学报,2004(03):340-345. |
| [22] | 陈党辉 .微电子组装用导电胶长期可靠性的研究[D].西安电子科技大学,2002. |
| [23] | Miener R;Aschenbrenner R;Reichl H.Correlation of thermomechanical properties of adhesives with reliability of FC interconnections[A].,1998:299. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%