采用扫描电子显微镜(SEM)、电子能谱仪(EDS)、X射线衍射仪(XRD)研究了铜基体上电沉积Ni(P)层的结构以及Ni(P)层对电沉积Sn-Cu合金/Cu界面固相反应的影响.研究表明:电沉积Ni(P)层为非晶结构,含29%(原子)的P,经过225℃热处理转变成晶态Ni5P2.经过225℃热处理,Sn-Cu合金/Cu界面反应在界面处形成连续的Cu6Sn5及Cu3Sn层.而Sn-Cu合金/电沉积Ni(P)-Cu界面反应微弱,主要在Sn-Cu合金/Ni(P)界面前沿的Sn-Cu合金中形成棒状或块状(Ni,Cu)3Sn4,Cu基底不与Sn-Cu合金反应.电沉积Ni(P)合金层能有效阻挡Sn-Cu合金/Cu界面反应.
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