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介绍了化学镀镍金工艺流程和工艺控制,探讨了温度对镀层沉积速率、渗金漏镀、镀层厚度的影响.提出选用高精度、高灵敏度、温度场更均匀的恒温控制设备可以显著提高化学镀镍金的品质.

参考文献

[1] 胡光辉,李大树,黄奔宇,蒙继龙.化学镀镍浸金金厚不均探究[J].材料保护,2006(07):64-65,75.
[2] SHALYT E;ALEYNIK S;PAVLOV M.Control of electroless nickel baths[J].HKPCA Journal,2007(20):1-6.
[3] 杨维生.化学镀镍金新工艺技术在印制板中的应用[J].电子工程师,2001(12):55-58.
[4] R.W.M. Kwok;K.C.M. Chan;M.W. Bayes .Development of an electroless nickel immersion gold process for PCB final finishes[J].Circuit world,2004(3):37-42.
[5] T.S.N. Sankara Narayanan;S.K. Seshadri .Formation and characterization of borohydride reduced electroless nickel deposits[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2004(1/2):197-205.
[6] Lin KY;Yang TJ;Tsai WT .Synthesis of Invar alloy powders by electroless plating[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2006(1-2):226-231.
[7] W.J. Cheong;Ben L. Luan;David W. Shoesmith .The effects of stabilizers on the bath stability of electroless Ni deposition and the deposit[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2004(1/4):282-300.
[8] DELAUNOIS F;LIENARD P .Heat treatments for electroless nickel-boron plating on aluminium alloys[J].Surface and Coatings Technology,2002,160(2-3):239-248.
[9] MALECKI A;MICEK-ILNICKA A .Electroless nickel plating from acid bath[J].Surface and Coatings Technology,2000,123(01):72-77.
[10] 马忠义,龚立.印制板化学镍金工艺研究[J].印制电路信息,2003(11):40-42.
[11] 蔡晓兰,黄鑫,贺子凯.化学镀镍磷合金镀速的研究[J].电镀与涂饰,2001(06):39-41.
[12] LI N H;PETROV N;KOLICS A .Temperature control sequence of electroless plating baths:[P].US 6875691,2005-04-05.
[13] 沈伟.化学镀镍工艺与控制(3)[J].材料保护,1995(05):36.
[14] 史筱超,崔艳娜,贺岩峰,郁祖湛.化学镀镍金层可焊性的影响因素[J].印制电路信息,2006(04):40-43.
[15] E. Huttunen-Saarivirta;T. Tiainen .Autocatalytic tin plating In the fabrication of tin-coated copper tube[J].Journal of Materials Processing Technology,2005(1/2):211-219.
[16] 卫桂芳.化学沉镍金漏镀渗金的原因和措施[J].印制电路信息,2004(05):35-37.
[17] 钟华 .多层印制线路板沉金工艺控制浅析[EB/OL].http://www.diamt.net.cn/xjzzjs/gjjs/process/EI/ei7.pdf,2003-12-23.
[18] ZENG K J;STIERMAN R;ABBOTT D et al.The root cause of black pad failure of solder joints with electroless Ni/immersion gold plating[J].Journal of the Minerals,Metals & Materials Society,2006,58(06):75-79.
[19] G. Milad;R. Mayes .Electroless nickel/immersion gold finishes for application to surface mount technology: a regenerative approach[J].Metal Finishing,1998(1A):42-46.
[20] 孟永德.沉金厚度分析与控制[J].印制电路信息,2004(02):42-43,54.
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