金属间化合物(IMC)在电子封装连接的过程中起到重要的作用,它是封装焊点可靠连接的标志.然而,由于IMC硬脆的固有属性,过厚的IMC层使连接可靠性变差.因此,研究IMC的性能有着重要的意义.介绍了测定IMC性能的常用方法,总结了IMC的主要性能,包括硬度、弹性模量,屈服强度及热膨胀系数等.
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