通过大量实验,对不同Sr/Ba比制作的SBBT高压陶瓷电容器的击穿特性进行了研究,指出瓷体中的局部还原现象是造成电容器瓷片击穿场强严重下降的原因所在.经过理论分析,提出施主离子Bi3+在固溶体中的不均匀分布导致瓷体还原的新观点.在此基础上,通过加入受主离子Mg2+克服了还原现象,使电容器的击穿场强大幅度提高.
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