欢迎登录材料期刊网

材料期刊网

高级检索

为了探索出能在较低温度、较宽温度范围内适合工业化生产的快速电镀镍工艺,以甲基磺酸盐溶液为基础,研究了添加剂种类、用量、施镀条件等对镀层内应力、形貌等影响的规律.结果表明:添加剂和施镀条件对镀层内应力和形貌有较大的影响,当添加剂糖精钠、1,4-丁炔二醇、对甲苯磺酰胺、十二烷基硫酸钠用量分别为2.00,0.40,0.50,0.05 g/L,镀液温度50℃,pH值3~4,电流密度10 A/dm2时,镀层内应力最小、质量最优;与传统的镀镍方法相比,本工艺具有高效、节能等突出特点.

参考文献

[1] C.S. Lin;P.C. Hsu;L. Chang;C.H. Chen .Properties and microstructure of nickel electrodeposited from a sulfamate bath containing ammonium ions[J].Journal of Applied Electrochemistry,2001(8):925-933.
[2] Ciszewski A;Posluszny S;Milczarek G;Baraniak M .Effects of saccharin and quaternary ammonium chlorides on the electrodeposition of nickel from a Watts-type electrolyte[J].Surface & Coatings Technology,2004(2/3):127-133.
[3] 曾燕屏.换向脉冲电镀工艺对镀镍层应力的影响[J].电镀与精饰,1992(03):22.
[4] 周英杰;满红娜 .电镀层内应力的产生和消除方法[J].涂料涂装与电镀,2005,3(03):13-16.
[5] 惠百平,费敬银,辛文利,刘江宏,王卫康.Zn-Ni合金电沉积过程中的渗氢行为[J].电镀与精饰,2006(02):10-13,41.
[6] 张午花,费敬银,骆立立,林西华.脉冲电沉积高速Ni工艺研究[J].中国腐蚀与防护学报,2013(04):317-324.
[7] N. M. Martyak .Electroless nickel plating from a methanesulfonate solution[J].Plating & Surface Finishing,2002(7):42-46.
[8] R.Balaji,Malathy Pushpavanam,罗慧梅.甲基磺酸在电镀相关金属精饰领域的应用[J].电镀与涂饰,2004(05):40-45.
[9] Stoney G G .The tension of metallic films deposited by electrolysis[J].Proc Roy Soc,1909,82:172-175.
[10] 张金凤;王明生 .电镀层内应力的测试方法[J].电镀与涂饰,1997,19(05):14-16.
[11] 巴志新,戴玉明,李庆敏,邹学武.电沉积工艺参数对纳米晶镍层显微硬度及沉积速率的影响[J].南京工程学院学报(自然科学版),2010(01):53-57.
[12] Kang, JX;Zhao, WZ;Zhang, GF .Influence of electrodeposition parameters on the deposition rate and microhardness of nanocrystalline Ni coatings[J].Surface & Coatings Technology,2009(13):1815-1818.
[13] Tohru W.Nano-plating microstructure control theory of plated films and database of plated film microstructure[M].Amsterdam:Elsevier,2004:344-356.
[14] Zeng Y P;Li Y G;Tang X Y et al.The effect of reverse pulse plating technology on the internal stress of electrodeposited nickel coatings[J].Plat Finish,1992,14(03):22-25.
[15] 康进兴;赵文珍;徐英鸽 等.电镀工艺对电沉积纳米晶镍电沉积速率的影响[J].热处理学报,2008,29(03):152-155.
[16] Xuetao Y;Yu W;Dongbai S;HongyIng Y .Influence of pulse parameters on the microstructure and microhardness of nickel electrodeposits[J].Surface & Coatings Technology,2008(9):1895-1903.
[17] Abdulin V S;Chernenko V I .The current efficiency and mechanical properties of nickel deposited in a pulse mode[J].Zashch Met,1982,18(06):964-966.
[18] Bakonyi I;Tóth-Kádár E;Pogány L et al.Preparation and Characterization of D.C-Plated Nanocrystalline Nickel Deposits[J].Surface and Coatings Technology,1996,78:124-136.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%