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通过开展BAS微晶玻璃成分优化研究,研制了0Cr18Ni9不锈钢基板的大功率厚膜电路介质层.在BAS系玻璃中加入适量MgO和CaO,在降低烧结温度的同时提高了析晶温度,抑制了晶体相的析出,有助于介质层的烧结致密化.利用成分优化后的BAS系玻璃制备的介质层与不锈钢基板结合强度高,具有优良的抗机械冲击能力.最佳配方的介质浆料经过3个烧结周期,制得介质层膜厚>100μm,击穿电压>2.1kV,泄漏电流<0.01mA.部分成果已经用于合作单位的工业化生产.

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