将一种含砜基芳香杂环二胺（DAMI）分别与均苯四酸二酐(PMDA)、3,3’,4,4’-联苯四酸二酐（BPDA）、3,3’,4,4’-二苯酮四酸二酐(BTDA)合成聚酰胺酸，经过热亚胺化制得聚酰亚胺，并将其应用于两层挠性覆铜板。对聚酰亚胺进行热学和力学性能测试，对两层挠性覆铜板进行剥离强度测试。结果表明：合成的聚酰亚胺的拉伸强度均大于90 MPa，玻璃化转变温度均在230℃以上；制备的两层挠性覆铜板剥离强度良好，聚酰亚胺与铜箔之间接触良好。
A aromatic heterocyclic diamine containing sulfuryl group (DAMI) was used to react with pyromelltic dianhydride(PMDA), 3,3’,4,4’-biphenyltetracarboxylic acid dianhydride(BPDA), and 3,3’, 4,4’-benzophenonetetracarboxylic dianhydride(BTDA) respectively, and three polyimide films were pre-pared through thermal imidization of polyamide acids, and then they were applied in 2-layer flexible cop-per clad laminate. The thermal and mechanical properties of polyimide and the peel strength of 2-layer flexible copper clad laminate were tested. The results show that the tensile strength of PI is greater than 90 MPa, and the glass transition temperature is above 230℃. The 2-layer flexible copper clad laminate has high peel strength, and the polyimide has good contact with the copper foil.
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