本文研究了发电厂循环冷却水环境中硫酸盐还原菌形貌特征和生长规律。应用EG&G的263A型恒电位仪比较研究了硫酸盐还原菌（SRB）生物膜对HSn-70-1AB和BFe30-1-1铜合金腐蚀的电化学行为；应用Cambridge S-360型扫描电镜,SAE X-射线能谱研究了HSn-70-1AB和BFe30-1-1铜合金表面生物膜特征并分析了其主要成分。结果表明，铜合金表面生物腐蚀与硫酸盐还原菌的生长特性密切相关，SRB处于对数生长期时，HSn-70-1AB和BFe30-1-1铜合金的自腐蚀电位和极化电阻均下降很快；而当SRB进入稳定生长阶段，两个铜合金的自腐蚀电位和极化电阻均缓慢下降。HSn-70-1AB和BFe30-1-1铜合金表面生物膜的形貌有较大区别。
The growth characterization for sulfate reducing bacteria (SRB) under anaerobic condition was studied. Measurements of corrosion potential and the polarization resistance were used to investigate the electrochemical behavior of HSn-70-1AB and BFe30-1-1copper alloys in medium containing sulfate reducing bacteria. The results shows that the biological corrosion of copper alloys is closely related to growth characterization of SRB. The corrosion potential and the polarization resistance of electrode for copper alloys drastically moved toward negative direction as the SRB was in the logarithm growth stage. While both of them would slowly drop down as SRB entered into stable growth stage. Scanning electron Microscopy and X-ray diffraction were respectively used to analyze the morphology and chemical composition of the biofilm. The results showed that biofilm characterization formed on the copper alloys were totally different.
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