采用过滤阴极真空电弧技术以相同的工艺条件在p(100)单晶硅衬底上制备了不同厚度的四面体非晶碳薄膜,并利用表面轮廓仪测试薄膜的厚度和应力,利用纳米压入仪测试薄膜的硬度、杨氏模量和临界刮擦载荷.试验表明,在一定的扫描波形条件下,薄膜大约以0.7 nm/s的沉积速率稳定生长.随着膜厚的增加,薄膜的应力持续降低,当膜厚超过30nm时,应力将低于5GPa;当膜厚超过300nm时,硬度和杨氏模量分别将近70GPa和750GPa,已经十分接近体金刚石的性能指标.另外,随着膜厚增加所产生的应力变化,也导致了可见光拉曼光谱非对称宽峰的峰位逐渐向低频偏移.
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