分别在电流密度2 A/dm2和20 A/dm2下，考察了美国杜邦的N117CS型离子交换膜、国产科润的Nepem-417型离子交换膜以及日本旭硝子的HSF型氢离子选择透过膜电解溶锡时的电流效率、锡利用率以及离子交换膜对 Sn2+的阻隔率。结果表明，电流密度为2 A/dm2时，3种离子交换膜电解溶锡的电流效率、锡利用率以及三者对 Sn2+的阻隔率均相差不大；但电流密度为20 A/dm2、且保证Sn2+质量浓度为(28±2) g/L时，旭硝子HSF 型离子交换膜的各项性能都比另外两种离子交换膜理想，电流效率84.16%，锡利用率94.82%，对Sn2+的阻隔率96.24%。因此镀锡板生产中电解溶锡时宜选用HSF型离子交换膜。
The current efficiency, tin utilization, and rejection rate of Sn2+during the electrolytic dissolution of tin with DuPont N117CS ion-exchange membrane, Kerun Nepem-417 ion-exchange membrane, or Japan Asahi Glass HSF ion-exchange membrane were studied at current density of 2 A/dm2 and 20 A/dm2, respectively. The results showed that there is little difference in the current efficiency, tin utilization, and rejection rate of Sn2+ when using the three above-mentioned ion-exchange membranes for electrolytic dissolution of tin at a current density of 2 A/dm2. However, at a current density of 20 A/dm2 and under the premise that the mass concentration of Sn2+ is kept to be 28±2 g/L, the performances of Asahi Glass HSF, i.e. current efficiency 84.16%, tin utilization 94.82%, and Sn2+ rejecting rate 96.24%, are more ideal than that of the other two kinds of ion-exchange membrane. Therefore it is reasonable to select the HSF ion-exchange membrane for electrolytic dissolution of tin during the production of tinplate.
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