采用动电位扫描和交流阻抗等方法研究Bi掺杂对Sn-3.0Ag-0.5Cu钎料在3.5％ NaCl(质量分数)溶液中电化学腐蚀性能及枝晶生长的影响；采用SEM和XRD技术分析其腐蚀形貌及成分.结果显示:随着Bi含量增加,腐蚀电流密度增大,但自腐蚀电位不呈规律性变化.阻抗谱显示:掺杂前后阻抗谱特征相同,均可用两个时间常数的等效电路模型表示,其拟合误差＜5％.随着Bi含量的增加,容抗弧半径减小,电荷传递电阻和腐蚀产物膜电阻均减小,耐蚀性能降低.SEM像显示,Bi掺杂对钎料在介质中电化学迁移速度有减缓作用,因而对迁移所致的枝晶生长具有抑制作用.XRD谱显示,枝晶主要成分为Sn和Cu6Sn5,同时伴有少量的Bi和Ag3Sn.
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