为了提高不饱和聚酯树脂(UPR)的性能,本文中以乙烯基笼型倍半硅氧烷(V-POSS)改性不饱和聚酯树脂,用非等温DSC法研究了UPR和5%V-POSS/UPR体系的固化反应动力学以及表观反应活化能与转化率之间的关系,测定了玻璃钢层压板的力学性能和电性能.结果表明,加入V-POSS固化反应Ea随反应程度增加而降低,通过使用两参数Sestak-Berggren(S-B)模型描述固化反应过程,得到了反应动力学方程.当V-POSS质量分数为5%时玻璃钢层压板拉伸强度达到最大值,提高了17.6 Mpa,冲击强度随V-POSS加入量增加而降低,但在10%时冲击强度有所上升.层压板电性能随V-POSS加入量增加而提高,其中体积电阻率和表面电阻率提高1～2个数量级.
参考文献
| [1] | 李艳,付绍云,林大杰,张以河,潘勤彦.二氧化硅/聚酰亚胺纳米杂化薄膜室温及低温力学性能[J].复合材料学报,2005,22(2):11-15.Li Yan,Fu Shaoyun,Lin Dajie,Zhang Yihe,Pan Qinyan.Mechanical properties of polyimide composites filled with SiO2 nanoparticles at room and cryogenic temperatures[J].Acta Materiae Compositae Sinica,2005,22(2):11-15. |
| [2] | 赫丽华,刘平桂,丁鹤雁.聚己内酯/环氧树脂/SiO2杂化材料的制备及性能[J].复合材料学报,2006,23(3):71-76.He Lihua,Liu Pinggui,Ding Heyan.Preparation and properties of polycaprolactone/epoxy/silica dioxide hybrids[J].Acta Materiae Compositae Sinica,2006,23(3):71-76. |
| [3] | 张学忠,黄玉东,王天玉,胡立江.CF表面低聚倍半硅氧烷涂层对复合材料界面性能影响[J].复合材料学报,2006,23(1):105-111.Zhang Xuezhong,Huang Yudong,Wang Tianyu,Hu Lijiang.Influence of oligomeric silsesquioxane coatings treatment on the interracial property of CF/PAA composites[J].Acta Materiae Compositae Sinica,2006,23(1):105-111. |
| [4] | Lichtenhan J D,Otonari Y A,Michael J C.Linear hybrid polymer building blocks:Methacrylate-functionalized polyhedral oligomeric silsesquioxane monomers and polymers[J].Macromolecules,1995,28(24):8435-8437. |
| [5] | Tsai M H,Whang W T,Tsai M H,Whang W T.Low dielectric polyimide poly silsesquioxane-like nanocomposite material[J].Polymer,2001,42(9):4197-4207. |
| [6] | Rosu D,Mustata F,Cascaval C N.Investigation of the curing reactions of some multifunctional epoxy resins using differential scanning calorimetry[J].Thermochimica Acta,2001,370(1/2):105-110. |
| [7] | Hseih H K,Chean C S,Woo E M.Cure kinetics and interdomain etherification in an amine-cured phenoxy/epoxy system[J].Polymer,1998,39(11):2175-2183. |
| [8] | 赵卫娟,张佐光,孙志杰,张大兴.非等温法研究TGDDM/DDS体系固化反应动力学[J].高分子学报,2006(4):564-568.Zhao Weijuan,Zhang Zuoguang,Sun Zhijie,Zhang Daxing.Cure kinetics of TGDDM/DDS system studied by nonisothermal method[J].Chinese J Polym Sci,2006(4):564-568. |
| [9] | Rosu D,Cascaval C N,Mustata F,et al.Cure kinetics of epoxy resins studied by non-isothermal DSC data[J].Thermochimica Acta,2002,383(1/2):119-127. |
| [10] | Braun D,Cherden H,Kerh W.聚合物合成和表征技术[M].黄葆同,译.北京:科学出版社,1981:245-247.Braun D,Cherden H,Kerh W.Techniques of polymer syntheses and characterization[M].Huang Baotong,trans.Bejing:Science Press,1981:245-247. |
| [11] | Gao J G,Jiang C J,Zhang X J.Kinetics of curing and thermal degradation of POSS epoxy resin/DDS system[J].Inter J Polym Mater,2007,56(1):65-77. |
| [12] | Saito H,Isozaki M.Cage type sesquialter oxosilane resin with functional group and its preparation method:Japan,2002-285387[P].2004-06-16. |
| [13] | Vyazovkin S,Mititelu A,Sbirrazzuoli N.Kinetics of epoxyamine curing accompanied by the formation of liquid crystalline structure[J].Macromol Rapid Commun,2003,24(18):1060-1065. |
| [14] | Malek J.Kinetic analysis of crystallization processes in amorphous materials[J].Thermochimica Acta,2000,355(1/2):239-253. |
| [15] | 胡荣祖,史启祯.热分析动力学[M].北京:科学出版社,2001:185-190.Hu Rongzu,Shi Qizhen.Thermal analysis kinetics[M].Beijing:Science Press,2001:185-190. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%