采用气压浸渗法制备高体积分数的镀TiC金刚石/铝复合材料,通过SEM和EDS等手段对复合材料的断口形貌进行分析,并研究TiC镀层对复合材料界面和热膨胀性能的影响.结果表明;TiC镀层改善金刚石颗粒与铝合金基体之间的选择性粘结现象,断裂方式以基体断裂为主.部分TiC会被氧化成TiO2并与铝合金基体反应生成Al2O3,从而实现金刚石颗粒与铝合金基体之间良好的界而结合;TiC镀层有效地降低复合材料的热膨胀系数(CTE),增强复合材料热膨胀性能的稳定性.在体积分数相同的情况下,CTE随金刚石颗粒尺寸的减小而减小.
参考文献
| [1] | 李婷婷,彭超群,王日初,王小锋,刘兵.电子封装陶瓷基片材料的研究进展[J].中国有色金属学报,2010(07):1365-1374. |
| [2] | 于家康;周尧和 .混杂2D-C/Al电子封装复合材料的设计与制备[J].中国有色金属学报,2000,10(z1):1-5. |
| [3] | 冯曦,郑子樵,李世晨,杨培勇.热压法制备Si-Al电子封装材料及其性能[J].稀有金属,2005(01):11-15. |
| [4] | YAMAMOTO Y;IMAI T;TANABE K;TSUNO T KUMAZAWA Y FUJIMORI N .The measurement of thermal properties of diamond[J].Diamond and Related Materials,1997,6(08):1057-1061. |
| [5] | 梁雪冰,褚克,贾成厂.放电等离子烧结制备Diamond/Al复合材料[J].复合材料学报,2008(06):192-197. |
| [6] | P.W. Ruch;O. Beffort;S. Kleiner .Selective interfacial bonding in Al(Si)-diamond composites and its effect on thermal conductivity[J].Composites science and technology,2006(15):2677-2685. |
| [7] | T. Schubert;L. Ciupinski;W. Zielinski .Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications[J].Scripta materialia,2008(4):263-266. |
| [8] | Schubert T;Trindade B;Weissgarber T;Kieback B .Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2008(1/2):39-44. |
| [9] | L. Weber;R. Tavangar .On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X (X = Cr, B) diamond composites[J].Scripta materialia,2007(11):988-991. |
| [10] | J.-M. Molina;M. Rheme;J. Carron .Thermal conductivity of aluminum matrix composites reinforced with mixtures of diamond and SiC particles[J].Scripta materialia,2008(5):393-396. |
| [11] | R. Tavangar;J.M. Molina;L. Weber .Assessing predictive schemes for thermal conductivity against diamond-reinforced silver matrix composites at intermediate phase contrast[J].Scripta materialia,2007(5):357-360. |
| [12] | C.Xue;J.K. Yu;X.M. Zhu .Thermal properties of diamond/SiC/Al composites with high volume fractions[J].Materials & design,2011(8/9):4225-4229. |
| [13] | T. HUBER;H.P. DEGISCHER;G. LEFRANC .Thermal expansion studies on aluminium-matrix composites with different reinforcement architecture of SiC particles[J].Composites science and technology,2006(13):2206-2217. |
| [14] | FENG H;YU J K;TAN W .Microstructure and thermal properties of diamond/aluminum composites with TiC coating on diamond particles[J].Materials Chemistry and Physics,2010,124(01):851-855. |
| [15] | COLTTERS R G .Thermodynamics of binary metallic carbides:A review[J].Materials Science and Engineering A,1985,76(1/2):1-50. |
| [16] | A.R. Kennedy;S.M. Wyatt .Characterising particle-matrix interfacial bonding in particulate Al-TiC MMCs produced by different methods[J].Composites, Part A. Applied science and manufacturing,2001(3-4):555-559. |
| [17] | Kennedy AR.;Jones MI.;Weston DP. .Reaction in Al-TiC metal matrix composites[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2001(1/2):32-38. |
| [18] | YeXia Qin;Di Zhang;WeiJie Lu .Oxidation behavior of in situ synthesized (TiB + TiC)/Ti-AI composites[J].Materials Letters,2006(19):2339-2345. |
| [19] | Flaquer J;Rios A;Martin-Meizoso A;Nogales S;Bohm H .Effect of diamond shapes and associated thermal boundary resistance on thermal conductivity of diamond-based composites[J].Computational Materials Science,2007(2):156-163. |
| [20] | VAIDYA R U J;CHAWLA K K .Thermal expansion of metal matrix composites[J].Composites Science and Technology,1994,50:13-22. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%