采用非真空熔炼和高压水雾化法制得Cu-0.6％Zr(质量分数)合金粉末,经粒径分选后进行低温氧化、N2+5％H2(体积分数)混合气体还原和真空等离子放电烧结(SPS)成型,制备得到ZrO2/Cu原位增强复合材料.结果表明:对合金粉末低温氧化处理时,温度过低,氧化速度慢,温度过高,易发生过氧化和粉末结块现象,最佳氧化参数为230℃×1h; N2+5％H2气体流量控制在200 mL/min条件下,通过烧氢实验确定最佳还原参数为250℃×1h;在30 MPa压力条件下,经850℃×2h真空放电等离子烧结(SPS),ZrO2/Cu试样的导电率＞83％IACS(international annealed copper standard),硬度＞HB 75,软化温度为900℃.
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