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通过在铜基体中添加V0.97W0.03O2制备了具有相变效应的Cu/V0.97W0.03O2复合材料,研究了添加相V0.97W0.03O2相变以及在Cu基体中的弥散程度对Cu/V0.97W0.03O2复合材料电导率的影响.采用场发射扫描电镜表征复合材料组织特征,利用X-ray衍射分析复合材料物相组成,并利用电导率测量系统检测不同温度下Cu/V0.97W0.03O2复合材料的电导率.结果表明,随高能球磨时间增加,铜基体中V0.97W0.03O2颗粒粒径越小,分布越弥散,对Cu/V0.97W0.03O2复合材料的电导率影响越明显.铜基体中的添加相V0.97W0.03O2会在0℃附近发生相变,导致Cu/V0.97W0.03O2复合材料相变前后的电导率变化幅度由5.41%升高到26.88%,相变效应增加明显.

参考文献

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