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基于对压电复合材料层合结构弱界面弹性场、电场、温度场的宏观和细观尺度分析,构建了四种界面力-电-热模型,分别为非耦合型、耦合型和混合型。依据这些界面模型,得到了柱面弯曲简支压电复合材料层板的力-电-热多场耦合解。结果表明,损伤界面的多场耦合物理描述介于宏观和细观尺度之间,需要多尺度考虑,且基于不同尺度的描述也可获得相似的规律。在热载和力载下,不同的界面模型对弹性场影响趋同、差异甚小,而对电场和温度场,四种模型的影响各异、但规律相似;在电载作用下,不同的界面模型无论对弹性场还是电场,都有显著的影响。

Based on macro-and meso-scales analysis on elastic,electric and thermal fields at a weak interface in piezoelectric composite laminates,four interfacial piezothermoelastic models(uncoupling,coupling and mixed) were built.According to these interfacial models,the piezothermoelastic coupling solutions of simply supported piezoelectric laminates with weak interfaces in cylindrical bending were obtained.Results show that the multi-fields coupling constitutive laws at a weak interface may be characterised in macro-and meso-scales,and some similarities among the interfaical models in different scales are observed.Under the thermal and force loads,the four models predict almost same elastic field,but similar distribution pattern of electric potential and temperature fields with different numerical results for the piezoelectric composite laminates.Under the electric loads,the differences of both elastic and elecric fields predicted by the four models are significant.

参考文献

[1] 杜善义. 先进复合材料与航空航天 [J]. 复合材料学报, 2007, 24(1): 1-12.
[2] Lu X, Liu D. Interlayer shear slip theory for cross-ply laminates with nonrigid interfaces [J]. AIAA Journal, 1992, 30: 1063-1073.
[3] Williams T O, Addessio F L. A general theory for laminated plates with delaminations [J]. Interational Journal of Solids and Structures, 1997, 34(16): 2003-2024.
[4] Shu X P, Soldatos K P. An accurate stress analysis model for angle-ply laminates with weak bounded layers [J]. Acta Mechanica, 2001, 150(3/4): 161-178.
[5] Shu X P, Soldatos K P. An accurate de-lamination model for weakly bonded laminates subjected to different sets of edge boundary conditions [J]. International Journal of Mechanical Science, 2001, 43(4): 935-959.
[6] Soldatos K P, Shu X P. Modelling of perfectly and weakly bonded laminated plates and shallow shells [J]. Composite Science and Technology, 2001, 61(2): 247-260.
[7] Seeley C E, Chattopadhyay A. Experimental investigation of composite beams with piezoelectric actuation and debonding [J]. Smart Material Structures, 1998, 7(4): 502-511.
[8] Seeley C E, Chattopadhyay A. Modeling of adaptive composites including debonding [J]. International Journal of Solids and Structures, 1999, 36(12): 1823-1843.
[9] Icardi U, Di Sciuva M, Librescu L. Dynamic response of adaptive cross-ply cantilevers featuring interlaminar bonding imperfections [J]. AIAA Journal, 2000, 38: 499-506.
[10] Shu X P. Modelling of cross-ply piezoelectric composite laminates in cylindrical bending with interfacial shear slip [J]. International Journal of Mechanical Sciences, 2005, 47(11): 1673-1692.
[11] Sun D, Tong L. Control stability analysis of smart beams with debonded piezoelectric actutor layer [J]. AIAA Journal, 2002, 40: 1852-1859.
[12] Chen W Q, Cai J B, Ye G R, Wang Y F. Exact three-dimensional solutions of laminated orthotropic piezoelectric rectangular plates featuring interlaminar bonding imperfections modeled by a general spring layer [J]. International Journal of Solids and Structures, 2004, 41(18/19): 5247-5263.
[13] Shu X P. Thermoelastic delamination of composite laminates with weak interfaces [J]. Composite Structures, 2008, 84(4): 310-318.
[14] Kapuria S, Nair P G. Exact three-dimensional piezothermoelasticity solution for dynamics of rectangular cross-ply hybrid plates featuring interlaminar bonding imperfections [J]. Composites Science and Technology, 2010, 70(5): 752-762.
[15] Hashin Z. Thermoelastic properties of fiber composites with imperfect interface [J]. Mechanics of Materials, 1990, 8(4): 333-348.
[16] Hashin Z. Thin interphase/imperfect interface in conduction [J]. Journal of Applied Physics, 2001, 89(4): 2261-2267.
[17] Benveniste Y. On the decay of end effects in conduction phenomena: A sandwich strip with imperfect interfaces of low or high conductivity [J]. Journal of Applied Physics, 1999, 86(3): 1273-1279.
[18] Benveniste Y. A general interface model for a three-dimensional curved thin anisotropic interphase between two anisotropic media [J]. Journal of the Mechanics and Physics of Solids, 2006, 54(4): 708-734.
[19] Parton V Z. Fracture mechanics of piezoelectric materials [J]. Acta Astronautics, 1976, 3(9/10): 671-683.
[20] Deeg W F. The analysis of dislocation crack and inclusion problems in piezoelectric solid. Stanford:Stanford University, 1980.
[21] Pak Y E. Crack extension force in a piezoelectric material [J]. Journal of Applied Mechanics, 1990, 57: 647-653.
[22] Fan H, Sze K Y. A micro-mechanics model for imperfect interface in dielectric materials [J]. Mechanics of Materials, 2001, 33(6): 363-373.
[23] Heyliger P R, Brooks S. Exact solutions for laminated piezoelectric plates in cylindrical bending [J]. Journal of Applied Mechanics, 1996, 63(4): 903-910.
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